Cadence Design Systems, Inc.

Zaid Khan

Mitchell Grant Poplack

Tarik Hanai Omar

TheHung Luu

Jerome Albert

Methods and systems herein can efficiently interconnect processors through a custom grid (a data mesh) utilizing upper metal layer routing in a semiconductor die design to minimize latency. A computer-implemented method of routing interconnects on a semiconductor die includes receiving a set of non-default routes and associated routing rules; identifying a set of critical signals for feedthrough on the set of non-default routes; generating a connectivity matrix including a set of resulting routes, the resulting routes routing the set of critical signals through the set of non-default routes; generating a timing analysis of the connectivity matrix based on a set of latency requirements; responsive to determining that the timing analysis is not compliant with the latency requirements, generating a set of routing constraints; and updating the associated routing rules to include the set of routing constraints.

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San Jose, CA, United States of America

Zaid Khan