Eastman Chemical Company

Zachary Philip Lee

John Cleaon Moore

Edward Enns McEntire

Michael Wayne Quillen

Dale Edward O'Dell

Spencer Erich Hochstetler

Richard Dalton Peters

Rodney Scott Armentrout

Darryl W Muck

Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

Processes and compositions for removing substances from substrates

Processess and compositions for removing substances from substrates

Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

Compositions and methods for removing organic substances

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Conyers, GA, United States of America

Zachary Philip Lee