Neuralink, Corp.

Zachary M Tedoff

Yu Niu Huang

Vanessa M Tolosa

Camilo A Diaz-Botia

Supin Chen

Felix Deku

Peter J Gilgunn

Mark J Hettick

Dominic A Herincx

The disclosure provides a method for fabricating a cantilever section in a structure, which includes providing a structure comprising a substrate, a compliant layer and a sacrificial layer therebetween; cutting part-way through the substrate to create an at least one linear partial cut; releasing the sacrificial layer from the structure; and breaking the substrate along the at least one linear partial cut to generate a cantilever section in a substrate.

Dicing and partial dicing release of lithographed device

Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

Monolithic, biocompatible feedthrough for hermetically sealed electronics and methods of manufacture

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Fremont, CA, United States of America

Zachary M Tedoff