Texas Instruments Corporation

Tower Semiconductor Ltd.

Zachary K Lee

Hong Yang

Yunlong Liu

Yufei Xiong

Sameer P Pendharkar

Constantin Bulucea

Seetharaman Sridhar

Philip Leland Hower

Peng Hu

John Lin

Guru Mathur

Honglin Guo

Scott Balster

Yongxi Zhang

Sharon Levin

Shye Shapira

Jingjing Chen

Wei Tang

An integrated circuit includes an SOI substrate having a semiconductor layer over a buried insulator layer; the semiconductor layer contains white space regions that include a PWELL region. An electronic device includes an NWELL region in the semiconductor layer, a dielectric over the NWELL region, and a polysilicon plate over the dielectric. A sacrificial NWELL ring is adjacent to and separated from the NWELL region by a first gap.

Contaminant collection on SOI

A semiconductor device includes a Schottky diode on a silicon-on-insulator (SOI) substrate. The Schottky diode includes a guard ring with a first guard ring segment contacting a barrier region on a first lateral side of the barrier region, and a second guard ring segment contacting the barrier region on a second, opposite, lateral side of the barrier region. The first and second guard ring segments extend deeper in the semiconductor layer than the barrier region. The Schottky diode further includes a drift region contacting the barrier region, and may include a buried layer having the same conductivity type as the barrier region, extending at least partway under the drift region. The barrier region is isolated from the substrate dielectric layer of the SOI substrate by an isolation region having the same conductivity type as the guard ring. A metal containing layer is formed on the barrier region.

Segmented Schottky diode

An LDMOS device includes a handle portion having a buried dielectric layer and a semiconductor layer thereon doped a second dopant type. A drift region doped a first type is within the semiconductor layer providing a drain extension. A gate stack includes a gate electrode on a gate dielectric layer on respective sides of a junction with the drift region. A DWELL region is within the semiconductor layer. A source region doped the first type is within the DWELL region. A drain region doped the first type is within the drift region. A first partial buried layer doped the second type is in a first portion of the drift region including under the gate electrode. A second partial buried layer doped the first type is in a second portion of the drift region including under the drain.

SOI power LDMOS device

A semiconductor device contains an LDNMOS transistor with a lateral n-type drain drift region and a p-type RESURF region over the drain drift region. The RESURF region extends to a top surface of a substrate of the semiconductor device. The semiconductor device includes a shunt which is electrically coupled between the RESURF region and a low voltage node of the LDNMOS transistor. The shunt may be a p-type implanted layer in the substrate between the RESURF layer and a body of the LDNMOS transistor, and may be implanted concurrently with the RESURF layer. The shunt may be through an opening in the drain drift region from the RESURF layer to the substrate under the drain drift region. The shunt may be include metal interconnect elements including contacts and metal interconnect lines.

Structures to avoid floating resurf layer in high voltage lateral devices

An semiconductor device with a low resistance sinker contact wherein the low resistance sinker contact is etched through a first doped layer and is etched into a second doped layer and wherein the first doped layer overlies the second doped layer and wherein the second doped layer is more heavily doped that the first doped layer and wherein the low resistance sinker contact is filled with a metallic material. A method for forming a semiconductor device with a low resistance sinker contact wherein the low resistance sinker contact is etched through a first doped layer and is etched into a second doped layer and wherein the first doped layer overlies the second doped layer and wherein the second doped layer is more heavily doped that the first doped layer and wherein the low resistance sinker contact is filled with a metallic material.

Low resistance sinker contact

Structures to avoid floating RESURF layer in high voltage lateral devices

A method of fabricating a FET includes forming a gate on the surface of a substrate. A trench contact extends between a first region located proximate the surface of the substrate and a second region located below the first region is formed in the surface. The surface of the substrate is coated with a conductive material, wherein the conductive material at least partially covers the gate and lines the trench contact to electrically connect the first region and the second region. A void remains in the trench contact. A dielectric material is applied to the conductive material, wherein the dielectric material at least partially fills the void in the trench contact. At least a portion of the conductive material is etched from the gate.

Field effect transistor and method of making

A vertical DMOS device implements one or more deep silicon via (DSV) plugs, thereby significantly reducing the layout area and on-resistance (RDS) of the device. The DSV plugs extend through a semiconductor substrate to contact a conductively doped buried diffusion region, which forms the drain of the vertical DMOS device. Methods for fabricating the vertical DMOS device are compatible with conventional sub-micron VLSI processes, such that the vertical DMOS device can be readily fabricated on the same integrated circuit as CMOS devices and analog devices, such as lateral double-diffused MOS (LDMOS) devices.

Deep silicon via as a drain sinker in integrated vertical DMOS transistor

Growing community of inventors

Fremont, CA, United States of America

Zachary K Lee