Xilinx, Inc.

Zachary Dickman

Tim Tuan

Juan J Noguera Serra

David Clarke

Peter McColgan

Baris Ozgul

Jan Langer

Javier Cabezas Rodriguez

Amarnath Kasibhatla

Saurabh Mathur

Francisco Barat Quesada

Goran H K Bilski

Goran Hk Bilski

Sneha Bhalchandra Date

Jose Marques

Pedro Miguel Parola Duarte

Peter Mccolgan

An apparatus includes a data processing array having a plurality of array tiles. The plurality of array tiles include a plurality of compute tiles. The compute tiles include a core coupled to a random-access memory (RAM) in a same compute tile and to a RAM of at least one other compute tile. The data processing array is subdivided into a plurality of partitions. Each partition includes a plurality of array tiles including at least one of the plurality of compute tiles. The apparatus includes a plurality of clock gate circuits being programmable to selectively gate a clock signal provided to a respective one of the plurality of partitions.

Multiple partitions in a data processing array

An integrated circuit (IC) can include a data processing array including a plurality of compute tiles arranged in a grid. The IC can include an array interface coupled to the data processing array. The array interface includes a plurality of interface tiles. Each interface tile includes a plurality of direct memory access circuits. The IC can include a network-on-chip (NoC) coupled to the array interface. Each direct memory access circuit is communicatively linked to the NoC via an independent communication channel.

Data processing array interface having interface tiles with multiple direct memory access circuits

An apparatus includes a data processing array having a plurality of array tiles. Each array tile can include a random-access memory (RAM) having a local memory interface accessible by circuitry within the array tile and an adjacent memory interface accessible by circuitry disposed within an adjacent array tile. Each adjacent memory interface of each array tile can include isolation logic that is programmable to allow the circuitry disposed within the adjacent array tile to access the RAM or prevent the circuitry disposed within the adjacent array tile from accessing the RAM. The data processing array can be subdivided into a plurality of partitions wherein the isolation logic of the adjacent memory interfaces is programmed to prevent array tiles from accessing RAMs across a boundary between the plurality of partitions.

Examples herein describe performing non-sequential DMA read and writes. Rather than storing data sequentially, a DMA engine can write data into memory using non-sequential memory addresses. A data processing engine (DPE) controller can submit a first job using first parameters that instruct the DMA engine to store data using a first non-sequential write pattern. The DPE controller can also submit a second job using second parameters that instruct the DMA engine to store data using a second, different non-sequential write pattern. In this manner, the DMA engine can switch to performing DMA writes using different non-sequential patterns. Similarly, the DMA engine can use non-sequential reads to retrieve data from memory. When performing a first DMA read, the DMA engine can retrieve data from memory using a first sequential pattern and then perform a second DMA read where data is retrieved from memory using a second non-sequential read pattern.

Multi-addressing mode for DMA and non-sequential read and write patterns

An integrated circuit having a data processing engine (DPE) array can include a plurality of memory tiles. A first memory tile can include a first direct memory access (DMA) engine, a first random-access memory (RAM) connected to the first DMA engine, and a first stream switch coupled to the first DMA engine. The first DMA engine may be coupled to a second RAM disposed in a second memory tile. The first stream switch may be coupled to a second stream switch disposed in the second memory tile.

Memory tiles in data processing engine array

A device may include a plurality of data processing engines, a subsystem, and an SoC interface block coupled to the plurality of data processing engines and the subsystem. The SoC interface block may be configured to exchange data between the subsystem and the plurality of data processing engines.

Growing community of inventors

Dublin, Ireland

Zachary Dickman