Lexmark International, Inc.

Zachary Charles Nathan Kratzer

Keith Bryan Hardin

Qing Zhang

Paul Kevin Hall

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.

Screening process for manufacturing a Z-directed component for a printed circuit board

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.

Die press process for manufacturing a Z-directed component for a printed circuit board

A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes depositing a liquid based material onto a top surface of a rotatable plate. The top surface of the rotatable plate has at least one cavity formed thereon that defines the shape of a layer of the z-directed component. The rotatable plate is spun to level a top surface of the liquid based material in the at least one cavity. The liquid based material is cured to form the layer of the z-directed component. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed including a stack of component layers that includes the formed layer.

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Lexington, KY, United States of America

Zachary Charles Nathan Kratzer