Northrop Grumman Systems Corporation

Zachary A Stegen

John Xavier Przybysz

Aaron A Pesetski

Robert Miles Young

Aaron Ashley Hathaway

Marc Eisenzweig Sherwin

Edward R Engbrecht

Gregory R Boyd

A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

Solid state cooler device

Growing community of inventors

Baltimore, MD, United States of America

Zachary A Stegen