Bull S.a.

Fci, Inc.

Delphi Technologies, Inc.

Framatome Connectors International

Aptiv Technologies Limited

Fci Asia Pte. Ltd.

Amphenol Fci Asia Pte. Ltd.

Yves Stricot

Gerard Dehaine

Abdelkrim Belhora

Nicolas Hermeline

Gnitaboure Yabre

Gert Droesbeke

Niranjan Kumar Mitra

Roland Marbot

Martin Ludwig

Stephane Barlerin

Michael Rucks

Claude Petit

Jean Razafiarivelo

Detlef Wiese

Alain Flers

Michel Moreau

Gnitabouré Yabre

Jan Van Koetsem

The invention relates to a network connector assembly for vehicles. The network communicates at data rates of 100 Mbit/s and/or 1 Gbit/s. The connector assembly includes a header having at least two pins forming a pin pair. The pins extend in a mating direction. The connector assembly also includes an electrically conductive shielding member shielding the pin pair on at least two sides. The shielding member has a front face that is oriented substantially normal to the mating direction. The connector assembly further includes a header shroud, wherein the header shroud is provided with a shielding cavity for receiving the shielding member. The front face of the shielding member is at least partly covered by the header shroud.

Network connector assembly and system for vehicles

Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Printed circuit board assembly and a method for manufacturing the printed circuit board assembly

An alignment pin for an optical communication system comprises: a first portion () extending along a direction in a receiving hole of a printed circuit board, a second portion () extending along this direction in a receiving through hole of an optical coupling device, a third portion () extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface () placed in contact with a parallel complementary surface () of the optical coupling device.

Alignment pin and optical communication system

An optical communication system comprising: an optical circuit board comprising an optical interface having a transmission region, an optical coupling device comprising: a first optical interface having a first transmission region optically coupled to a corresponding transmission region of the optical interface of the optical circuit board, a second optical interface having a second transmission region adapted to be optically coupled to a corresponding transmission region of an optical interface of a mating optical device, a fixation part, wherein the optical communication system comprises a support element glued to the fixation part of the optical coupling device and removably mounted on the optical circuit board.

Dismountable optical coupling device

An optoelectric device ( ) has an emitter and/or receiver ( ) on a first element ( ) of a printed circuit ( ) of this device. Moreover, the device has at least one second printed-circuit element ( ) such that the second element is not in alignment with the first element. And consequently, the device provides for the first element and the second element to be applied against separate and secant faces of a heatsink ( ) of the device. The function of this heatsink is to evacuate the heat emitted by an optic connection provided on the device. The heatsink also permits supporting and holding the different portions of the printed circuit.

Optoelectronic emitter-receiver device

An electro-optical connection module ( ) comprises a first end ( ) designed to receive optical fibers ( ), and comprises means ( ) to convert a signal conveyed by these optical fibers into an electrical signal. These means are preferably placed on a rigid portion ( ) of a printed circuit ( ) contained in this module. Furthermore, this printed circuit portion is connected by means of a flexible printed circuit portion ( ) to a printed circuit end ( ). This printed circuit end has contacts ( ) in the form of an electrical plug at one end ( ) of this module. This second end is opposite to the first end of the module. Thus, the optical module is used for an electrical connection and comprises every means to convert the optical signal received into an electrical signal.

Electro-optical connector with flexible circuit

Pbga package with integrated ball grid

The invention applies to packages for transmitting signals at very high frequencies. A package (10) for the integrated circuit (11) comprises conductors disposed on at least two levels (N1-N6) and distributed so that two pairs of conductors of two fixed potentials (18d, 18g; 19d, 19g), along with a conductor (18s) for single-pole transmission of a signal, form a three-dimensional structure which is approximately coaxial having a characteristic impedance which is substantially constant and predetermined.

Three-dimensional integrated circuit package having conductors at

A device for mounting a first element onto a second element to sandwich an electrical or electronic component therebetween, wherein the device is operable to cause the first element to exert a contact force on the component when the first element is mounted onto the second element and to couple the device to the first element in a manner which exerts a mounting force on the first element which is independent of whether the first element is mounted onto the second element. The first element may be a heat sink and the second element may be a printed circuit board.

Mounting device for electronic components

Process and substrate for connecting an integrated circuit to another

Growing community of inventors

Villepreux, France

Yves Stricot