Freescale Semiconductor,inc.

Koninklijke Philips Corporation N.v.

Stmicroelectronics (Crolles 2) Sas

Yves Rody

Kevin Dean Lucas

Kyle W Patterson

Robert Elliott Boone

Christophe Couderc

Corinne Miramond-Collet

Method and apparatus for designing an integrated circuit by calculating an optimised reticle layout design from an IC layout design and a model describing an optical system for transferring the IC layout design onto a semiconductor wafer using a reticle, wherein the IC layout design comprises features defined by a plurality of boundaries. Approximating the plurality of boundaries to generate an approximated IC layout design suitable for the manufacture of the IC. Performing OPC simulation on at least a portion of the approximated IC layout design.

Method and apparatus for designing an integrated circuit using inverse lithography technology

For cases where one edge of a design feature is to be printed through a shifter mask and another one is to be printed through a binary trim mask, and where no upsizing can be performed due to the local density of the design, it is proposed to add shifters with respect to the shifter mask in such a way that all the edges are printed by the phase shift mask.

Printing of design features using alternating PSM technology with double mask exposure strategy

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Eindhoven, Netherlands

Yves Rody