Murata Machinery, Ltd.

Brooks Automation (germany) Gmbh

Brooks Automation Gmbh

Yves Fenner

Gerhard Dovids

Bernd Rahrbach

Christian Wohanka

John Fiddes

Thomas Schober

Fachri Atamny

Lutz Rebstock

Karl Meier

The invention relates to an apparatus (A,) for a semiconductor production facility handling an object, the apparatus comprising a core module () and at least one functionality module (M . . . ). A core module () as well as an operating method for such an apparatus are further aspects of the invention.

Core module for semiconductor production facility machinery

Carrier, container or other system that provides a separation and protection for substrates, wafers, etc. for before, during or after processing or storage through the use of a membrane integral to the carrier or container respectively. This includes for use with Tec-Cell systems with high and low density configurations as well as other standardized systems, such as FOUPs. Includes protection for contamination brakeage chafing, through isolation and containment. Additional features are included such as the membrane providing guides or otherwise increasing efficiency or presence of airflow, such as laminar airflow over each substrate, wafer, etc. being held.

Substrate carriers with isolation membrane

Methods, systems and apparatuses for an improved wafer and substrate carrier or container with improved modularity. More specifically, to a carrier or container with improved abilities which may provide high or low density carriers or containers with improved interchanging and compatibility, including for Tec-Cells, FOUPs, and other third party containers, carriers, modules, rings or any other systems, structures, apparatuses, or methods associated. The invention may provided an ability to interchange or be cross-compatible such as wherein Tec-Cell carriers, containers, rings or modules may be provided to be housed in a FOUP or other third party carrier or wherein substrates or wafers held in the Tec-Cell Carriers, rings, containers, or modules, and then held within the FOUP.

Modularity of Tec-Cell, FOUP and substrate containers and carriers

An opener apparatus that accommodates and opens a substrate carrier stack of substrate carriers stacked in a vertical direction, includes a movement mechanism that moves all of the substrate carriers or a sub-group of the substrate carriers relatively with respect to each other along a vertical axis in an opening operation to assume an unstacked state and to be positioned at defined vertical opened positions within the opener apparatus with vertical distances between vertically adjacent substrate carriers in the unstacked state. The opener apparatus also moves the substrate carriers in the unstacked state relatively with respect to each other along the vertical axis in a closing operation to reassume a stacked state.

Opener apparatus

A substrate carrier stack includes substrate carriers of only one type which are stacked or stackable on each other and carry a respective plate-shaped substrates within an inner accommodation space of the substrate carrier stack. The substrate carriers each include positioning formations. Positioning formations of each pair of an upper substrate carrier and a lower substrate carrier are mutually engaged or engageable, if the upper substrate carrier and the lower substrate carrier are properly positioned relative to each other.

Substrate carrier and substrate carrier stack

A substrate carrier stack includes substrate carriers which are stacked or stackable on each other and carry substrates within an inner accommodation space of the substrate carrier stack. The substrate carrier stack includes at least one first purging channel and at least one second purging channel, which extend vertically parallel to the inner accommodation space at opposing sides thereof, and purging structures which enable horizontal purging flows within the substrate carrier stack through spaces between substrates held by the substrate carriers. The substrate carriers each include an outer carrier frame provided with a seat to carry a substrate, wherein the outer carrier frame extends around the first and second purging channels and the inner accommodation space.

The invention disclosed relates generally to handling substrates and wafers. In an example embodiment, to an improved wafer and substrate carrier or carrier system, method or apparatus. More specifically, to a carrier with improved abilities which may provide high density carriers, improved efficiency and other abilities such as increased cleanliness and reduced contamination to wafers during handling, storage or processing as well as higher density storage and better stocking, storage and handling abilities.

High density Tec-Cell carrier

A substrate production, manufacturing, and processing system includes storages with one or more separations that store substrates, loading stations that include robots, opener systems, and a software management system. The storage separations hold first containers that store carriers and the substrates in stacks. Each robot is able to access and move at least one of: the first container, a second container or carrier, and one of the substrates. The opener systems open the first containers such that the carriers and the substrates are able to be accessed by the robots in the loading station, and the software management system assigns at least one category to each stack of carriers and the substrates. The first containers store the substrates with a higher density than the second container or carrier, and the opener systems each include effectors that each hold an individual one of the substrates.

Substrate stocker and systems management software

This disclosure relates generally to substrate and manufacturing system, processes and methods. In one example embodiment, to methods, apparatus, and systems which provides improved substrate processing and manufacturing wherein at least a portion of the system, apparatus or method may be in an overhead system, such as attached to a ceiling or overhead mounts, such that floor space and other efficiencies may be founded.

Overhead manufacturing, processing and storage system

The system, method and apparatus described relates generally to a device related to substrate storage and processing. In one example embodiment to methods, apparatus, and systems of a substrate storage and processing module improving upon existing devices used in one or more instances for substrate transportation, sorting, and cleaning. The single piece design system may contain and support substrates in a method, reducing strain on its contents by utilizing an innovative support system without the use of standard clamping techniques and, in this or other iterations, such stacking methods may minimize chaffing of surfaces. Thus the device is vastly improved in its ability to preserve pristine conditions of contained substrates.

Substrate storage and processing

A substrate stocker system includes a high-density storage chamber that comprises one or more stacks of one or more substrates in a closed position, one or more low density containers that are configured to store one or more substrates in an open position, one or more opener stations that are configured to receive one or more substrates and includes one or more separator modules for changing one or more distances between corresponding one or more adjacent substrates. The substrate stocker system further includes a first robot configured to move one or more stacks between the high-density storage chamber, and the one or more opener station, and a second robot configured to move the individual one or more substrates between the one or more opener stations and the one or more low density containers.

Growing community of inventors

Berg, Switzerland

Yves Fenner