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Yves Dupraz

Christoph Kuratli

Pinchas Novac

Pierre Muller

Alexis Durand

Gordon Limond

Amrane Belkacem

A tamper-evident RFID Tag () and a method for manufacturing it. The method () may provide () at least one protection layer () before being cured () such as to turn the at least one protection layer () into at least one degradable layer (), and to prevent an assembly or a reassembly of the tamper-evident RFID Tag () after any attempt of harvesting of the tamper-evident RFID Tag ().

Tamper-evident RFID tag and method thereof

An electronic system is provided, including an integrated circuit die having at least 2 bond pads, and a redistribution layer having at least one solder pad including 2 portions separated from each other and configured to provide an electrical connection between each of the 2 portions by a solder ball disposed on the solder pad, and to electrically isolate the 2 portions in an absence of the solder ball on the solder pad, and at least 2 redistribution wires, each connecting a different one of the portions to a different one of the bond pads, a second bond pad being connected via a second redistribution wire to a second portion being dedicated to die testing; and a grounded printed circuit board track, wherein the solder ball is disposed between the solder pad and the track, and neither of the redistribution wires traverses a separation space between the 2 portions.

Integrated circuit die having a split solder pad

The present invention relates to a humidity sensor comprising a silicon base plate on which at least a plurality of dielectric layers, each provided with a metallic zone, and a metallic layer are arranged, said metallic layer being etched in order to form two electrodes, each comprising one armature provided with a multitude of arms, these armatures being mounted so that the arms of each armature are interlaced in order to have arms placed opposite each other and separated by gaps.

Method for manufacturing humidity sensor

An integrated circuit die having at least two bond pads, a redistribution layer, the redistribution layer including at least one solder pad including comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on the solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.

Growing community of inventors

Valeyres-sous-Montagny, Switzerland

Yves Dupraz