International Business Machines Corporation

King Abdulaziz City for Science and Technology

Hitachi Global Storage Technologies Netherlands B.v.

Globalfoundries Inc.

Apple Inc.

Yves Corfield Martin

Theodore Gerard Van Kessel

Hemantha Kumar Wickramasinghe

Hendrik F Hamann

Robert L Sandstrom

Tymon Barwicz

Supratik Guha

Jason Scott Orcutt

William M Green

Matthew Earl Colburn

Bruce Kenneth Furman

Naim Moumen

Hussam Khonkar

Roger R Schmidt

Brent A Wacaser

Alhassan Badahdah

Madhusudan K Iyengar

Jae-Woong Nah

Sushumna Iruvanti

Hematha K Wickramasinghe

Michael A Gaynes

Paul Alfred Lauro

Dirk Pfeiffer

Lubomyr Taras Romankiw

Johann Greschner

Lionel Tombez

James Andrew Lacey

Kenneth Gilbert Roessler

Thomas Bayer

Peter Daniel Kirchner

James Michael Hammond

Helga Weiss

Wei Zou

Alan Claassen

Ayman Alabduljabbar

Abdullah I Alboiez

Yaseen G Alharbi

Jeffrey Donald Gelorme

David Brian Mitzi

Martin O Sandberg

Xiaojin Wei

Nancy C LaBianca

Philip C Hobbs

Martin Patrick O'Boyle

Olaf Wolter

Matteo Flotta

Dhirendra Patel

Frederic Zenhausern

Martin A Klos

Robert M Stowell

Theodore Van Kessel

Da Yuan Shih

Josephine B Chang

Eric Vance Kline

Jeffrey Scott Lille

Da-Yuan Shih

Neil Leslie Robertson

Prabjit Singh

Richard Alan Haight

David L Edwards

Douglas Max Gill

Jan-Ulrich Thiele

Vivekananda P Adiga

Michael D Hillman

Dong Chen Chen

Hanhee Paik

Chie Ching Poon

Gregory L Tice

Prakash Kasiraj

Klaus Meissner

Harry Jonathon Mamin

Richard Lidio Blanco

Abdelmajid Salhi

Edwin Flecha

Ronald Jack Smith

Aparna Prabhakar

Sean A Bailey

Phillip Lee Mort

Jay E Pogemiller

Jordan Poler

Anthony Santiago

Antoine Hervier

Circuits and methods of operation that can facilitate reducing surface losses for quantum devices are provided. In one example, a quantum device can comprise a dielectric layer, a first electrode, and a second electrode. The dielectric layer can comprise a recess formed in a surface of the dielectric layer that reduces a thickness of the dielectric layer from a first thickness external to a footprint of the recess to a second thickness within the footprint of the recess. The second thickness can be less than the first thickness. The first electrode can be positioned within the footprint of the recess. The second electrode can be electrically isolated from the first electrode by the dielectric layer. The first and second electrodes can be positioned on opposing surfaces of the dielectric layer.

Quantum device with low surface losses

A method for improving lifetime and coherence time of a qubit in a quantum mechanical device is provided. The method includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit having capacitor pads. The method further includes at least one of removing an amount of substrate material from the backside of the substrate at an area opposite the at least one qubit or depositing a superconducting metal layer at the backside of the substrate at the area opposite the at least one qubit to reduce radiofrequency electrical current loss due to at least one of silicon-air (SA) interface, metal-air (MA) interface or silicon-metal (SM) interface so as to enhance a lifetime (T1) and a coherence time (T2) in the at least one qubit.

Superconducting qubit lifetime and coherence improvement via backside etching

A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.

Self-alignment features for III-V ridge process and angled facet die

A sensor housing apparatus includes a housing having an enclosure and outer assembly, at least one flow path extending through the housing, a gas sensor disposed in the enclosure and a thermal mass. The thermal mass is mounted within the enclosure in thermal communication with the gas sensor, and is configured to transfer thermal energy from the gas sensor to an ambient environment surrounding the housing and minimize temperature gradients adjacent the gas sensor.

Housing apparatus for sensitive gas sensor

Solder-pinning metal pads for electronic components and techniques for use thereof to mitigate de-wetting are provided. In one aspect, a structure includes: a substrate; and a solder pad on the substrate, wherein the solder pad has sidewalls extending up from a surface thereof. For instance, the sidewalls can be present at edges of the solder pad, or inset from the edges of the solder pad. The sidewalls can be vertical or extend up from the solder pad at an angle. The sidewalls can be formed from the same material or a different material as the solder pad. A method is also provided that includes forming a solder pad on a substrate, the solder pad comprising sidewalls extending up from a surface thereof.

Solder-pinning metal pads for electronic components

A light concentrating optic for use with a photovoltaic device includes a light pipe having a first end portion for receiving light and a second end portion for outputting concentrated light. An optical element is coupled to the light pipe on the first end portion and configured to form an optical interface between the light pipe and the optical element. The optical element includes at least one light transmitting surface configured to redirect incident light entering the optical element to disperse the light to fall incident on side walls of the light pipe to increase homogeneity and intensity of light through the second end portion.

Secondary optic for concentrating photovoltaic device

A gas sensor enclosure is provided. The gas sensor enclosure includes at least two coaxial shells, a gas sensor, a gas permeable membrane that exposes a portion of the gas sensor to gas exchange through one of the at least two coaxial shells and a screen. The screen encloses the at least two coaxial shells, the gas sensor and the gas permeable membrane.

Method of assembling a fugitive gas sensor enclosure

Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Single edge coupling of chips with integrated waveguides

Techniques for cooling concentrating solar collector systems are provided. In one aspect, an apparatus for cooling a photovoltaic cell includes a heat exchanger having a metal plate with a bend therein that positions a first surface of the metal plate at an angle of from about 100 degrees to about 150 degrees relative to a second surface of the metal plate, and a plurality of fins attached to a side of the metal plate opposite the first surface and the second surface; a vapor chamber extending along the first surface and the second surface of the metal plate, crossing the bend; and a cladding material between the vapor chamber and the heat exchanger, wherein the cladding material is configured to thermally couple the vapor chamber to the heat exchanger. A photovoltaic system and method for operating a photovoltaic system are also provided.

Cooling system for high performance solar concentrators

A method for assembling a semiconductor device includes: receiving a first chip including a plurality of first bonding pads, a first standoff and a second standoff, wherein a first solder is deposited on each of the first bonding pads; depositing a second solder on each of the first and second standoffs; arranging a second chip over the first chip, wherein the second chip includes a plurality of second bonding pads, and at least one of the second bonding pads has a corresponding first bonding pad; heating the second chip over a melting point of the second solder to melt the second solder, and placing the second chip on the first chip to touch and solidify the second solder on each of the first and second standoffs; performing a reflow process to melt the first solder on each of the first bonding pads so that at least one of the first solders touches a corresponding second bonding pad; and waiting a predetermined period of time to allow the second chip to move until a side edge of the second chip touches a waveguide of the first chip.

Optimized stand-offs and mechanical stops for precise three dimensional self-alignment

Growing community of inventors

Ossining, NY, United States of America

Yves Corfield Martin