Centre National De La Recherche Scientifique

Institut Polytechnique De Grenoble

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Université Grenoble Alpes

Labinal Power Systems

Institut Polytechnic De Grenoble

Yvan Avenas

Laurent Clavelier

Julie Widiez

Jean-Christophe Crebier

Jacques Salat

Regis Bernard Albert Meuret

Kremena Vladimirova

Mansour Tawk

Wendpanga Bikinga

Bachir Mezrag

Regis Bernard Meuret

A power electronic system including a plurality of power components and a plurality of electrically-conductive heatsinks, each of said power components being disposed between two electrically-conductive heatsinks of the plurality of electrically-conductive heatsinks, at least one electrically-conductive heatsink being configured to be polarised according to a phase potential, called phase heatsink, at least one electrically-conductive heatsink being configured to be polarised according to a +DC potential, called cathode heatsink, and at least one electrically-conductive heatsink configured to be polarised according to a −DC potential, called anode heatsink, the system further includes at least one external phase connection, and at least one external +DC connection, and at least one external −DC connection respectively connected to the phase heatsink, to the cathode heatsink and to the anode heatsink.

Modular power electronics system with electrically-conductive heatsink polarization

The disclosure relates to an electronic system including a plurality of adjacent, elementary power electronics modules and connected to one another by an electrical module connection. Each elementary module including at least one power component integrated on a printed circuit inserted between two electrically conductive heat sinks. The electrical module connection is made by heat sinks at the side and/or central connection surfaces thereof.

Power electronics system

An electronic device with cooling of a heat dissipation source, by a liquid metals spreader, the device including at least one heat dissipation source, at least one spreader through which at least one liquid metal circulation channel passes forming a loop routed below a heat dissipation source, at least one heat sink, and at least one electromagnetic pump moving the liquid metal in the at least one channel such that the liquid metal absorbs heat dissipated by a heat dissipation source and transports the absorbed heat to be evacuated by the heat sink. Each spreader includes at least two plates made of an electrical insulating material located on each side of at least one bar made of deformable material.

Electronic device with cooling by a liquid metal spreader

The invention relates to an electronic chip, comprising: a semiconductor substrate () having an active area () formed by at least one P doped region and at least one N doped region which form one or more P-N junctions through which most of the useful current flows when said electronic chip is in a conductive state, and at least one channel () through which a heat transport coolant can flow, the channel(s) passing through at least said P or N doped region of the active area. Each channel () is rectilinear and passes through the substrate () in a direction which is collinear with a direction F to the nearest &#xb1;45&#xb0;, where the direction F is perpendicular to the plane of the substrate.

Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip

Growing community of inventors

Poisat, France

Yvan Avenas