Canon Kabushiki Kaisha

Mitsui Toatsu Chemicals, Incorporated

Toyo Engineering Corporation

Yuzuru Ishida

Maki Kato

Yoshinori Misumi

Takahiro Matsui

Ichiro Saito

Norihiro Yoshinari

Takeru Yasuda

Tsubasa Funabashi

Makoto Sakurai

Kenji Takahashi

Sadayoshi Sakuma

Takuya Hatsui

Akio Goto

Hirokazu Komuro

Kazuaki Shibata

Norifumi Ito

Mune Iwamoto

Tetsuyuki Matsubara

Haruo Inoue

Masahiro Mitsuboshi

Soichiro Nagamochi

Ichiro Otsuka

Keiji Iio

Nobuyuki Hirayama

Souta Takeuchi

Koichi Omata

Ryoji Oohashi

Yoshiyuki Imanaka

Shuzo Iwanaga

Masaki Oikawa

Hideo Tamura

Koichi Ishida

Keiji Tomizawa

Toshiyasu Sakai

Kousuke Kubo

Atsushi Koike

Yuji Tamaru

Tomohiro Sato

Atsushi Hashimoto

Masato Takaku

Tetsuo Maeda

Shuichi Tamatsukuri

Shinya Iwahashi

Yasuo Furuta

Ichirou Otsuka

A liquid ejection head substrate includes a base layer, a heating resistance element provided over the base layer to generate a heat energy for ejecting a liquid, a first insulation layer covering the heating resistance element, and a protective layer having, on the first insulation layer, a first region which overlaps the heating resistance element via the first insulation layer and a second region which does not overlap the heating resistance element and formed of a material including a metal which is eluted by an electrochemical reaction. The liquid ejection head substrate further includes a second insulation layer provided over a region overlying the base layer and not provided with the protective layer and over the second region of the protective layer.

Liquid ejection head substrate, liquid ejection head, and method of manufacturing liquid ejection head substrate

One embodiment of the present invention is a liquid ejection apparatus having: a liquid ejection head including a heating element, a first protection layer that blocks contact between the heating element and liquid, a second protection layer that partially covers the first protection layer and functions as a first electrode, a second electrode that is electrically connected to the first electrode through the liquid, and an ejection port that ejects the liquid; and a control unit configured to perform control of setting a potential difference between the first electrode and the second electrode to a predetermined value in each of aging and printing by changing at least one of potentials of the first electrode and the second electrode, wherein ΔVa≠ΔVp is satisfied in the case where the potential difference in the aging is represented by ΔVa and the potential difference in the printing is represented by ΔVp.

Liquid ejection apparatus and control method

A substrate includes a layer including a base material and an intermediate layer including a wiring layer, an element formed on a side of the intermediate layer, and configured to generate energy for discharging a liquid, an insulating layer covering the element and the layer against a liquid chamber, and a conductive layer formed on the insulating layer so as to cover the element against the liquid chamber. The substrate further includes an electric connecting portion configured to electrically connect the wiring layer and the element, a non-insulated portion formed on a side of the intermediate layer and configured to be covered by the insulating layer against the liquid chamber, and an opening portion formed in the insulating layer at a position. The non-insulated portion is connected to the conductive layer via the opening portion.

Liquid discharge head substrate and printing apparatus

A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

Liquid ejection head and method for manufacturing liquid ejection head

An object is to provide a liquid ejection apparatus and a method of controlling a liquid ejection apparatus capable of preventing bubbles generated by kogation removal from interfering with the kogation removal. To this end, in a long liquid ejection head with a liquid circulated therethough, a pressure chamber is pressurized and a voltage is applied to a heat applying portion and an electrode to perform kogation removing cleaning.

Liquid ejection apparatus and method of controlling liquid ejection apparatus

An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.

Element substrate, liquid discharge head, and printing apparatus

An electrode pad portion of a liquid ejection head substrate includes a layer containing one of an iridium metal and an iridium alloy, and at least a portion of a cavitation resistant layer is provided in the same layer with the same material as the layer containing one of the iridium metal and the iridium alloy.

Liquid ejection head substrate and manufacturing method of the same

A liquid discharge head includes a flow passage forming member, an element substrate including a liquid discharge element and a surface on which a conductive member made from a metallic material is disposed, and an intermediate layer made from a resin material and configured to join the flow passage forming member and the surface of the element substrate to each other. The intermediate layer is disposed in a state, separated from the conductive member, where the conductive member is exposed from the intermediate layer. The conductive member is covered with the flow passage forming member.

Liquid discharge head

A method of cleaning a liquid discharge head includes first eluting a first electrode and second eluting a second electrode. In the cleaning method, the first eluting and the second eluting are executed such that a ratio between a first electric power amount used in the first eluting and a second electric power amount used in the second eluting is a ratio based on a ratio between an area of a first face of the first electrode and an area of a second face of the second electrode.

Cleaning method of liquid discharge head and liquid discharge apparatus

In a layer including print elements and a layer below the layer including the print elements in a lamination direction of a print element substrate, the print elements and drive circuits are arranged point-symmetrically about the center of the substrate viewed from a side where discharge ports that allow the liquid to be discharged are open, and in an upper layer over the layer including the print elements in the lamination direction, functional elements are arranged in a direction of liquid flow in which the liquid flows from supply ports to collection ports while passing above the print elements.

Print element substrate, liquid discharge head, and liquid discharge apparatus

A liquid ejection apparatus, an ejection control method, and a liquid ejection head are capable of suppressing shortening of the life of the liquid ejection head and maintaining stable ejection operation. For this purpose, voltage is applied to upper electrodes and counter electrodes so as to make the voltage at the upper electrodes lower than the voltage at the counter electrodes before heat generating resistive elements are driven, and voltage is applied to the upper electrodes and the counter electrodes so as to make the voltage at the upper electrodes higher than the voltage at the counter electrodes at the same time as or after the start of driving of the heat generating resistive elements.

Liquid ejection apparatus, ejection control method, and liquid ejection head

A liquid ejection head substrate including a base including a surface having a first and second heat generation elements, a conductive first covering portion, a conductive second covering portion, an insulating layer disposed between the first heat generation element and the first covering portion, and between the second heat generation element and the second covering portion, a fuse portion, first wiring electrically connected to the first covering portion through the fuse portion, the first wiring electrically connecting the first covering portion to the second covering portion, a terminal electrically connected to the first covering portion and the second covering portion through the first wiring, second wiring, and electric connection portions provided between the fuse portion and the terminal in a current path passing through the first wiring, the electric connection portions parallelly connecting the first and second wiring to each other.

Liquid ejection head substrate, method of manufacturing liquid ejection head substrate, and liquid ejection head

A liquid discharge apparatus includes a plurality of anti-cavitation layers formed to cover heat generating elements at positions where the anti-cavitation layers contact the liquid, a monitoring unit that detects a current flowing through the anti-cavitation layers, and a plurality of switching units that switch whether to apply, to the heat generating elements, a voltage for driving the heat generating elements. If the monitoring unit detects that a current greater than a predetermined value has flowed through one of the anti-cavitation layers while the voltage is applied to the heat generating elements, a control unit sequentially switches the plurality of switching units, and specifies the heat generating element corresponding to the anti-cavitation layer through which the current has flowed, among the heat generating elements.

Liquid discharge apparatus and control method thereof

The liquid discharge head substrate includes a first covering portion that covers the first heat generation element and that has conductivity, a second covering portion that covers the second heat generation element and that has conductivity, an insulative layer disposed between the first heat generation element and the first covering portion and between the second heat generation element and the second covering portion, a fuse portion provided on the substrate on a side on which the first covering portion is provided, common wiring for electrically coupling the first covering portion and the second covering portion, the common wiring coupled with the first covering portion via the fuse portion, and a cover layer including at least silicon and carbon and covering the fuse portion.

Liquid discharge head substrate and liquid discharge head

Provided is a liquid ejection head substrate having a base, a heat generating resistor layer formed on or above the base and including an electrothermal conversion portion, a wiring electrically connected to the heat generating resistor layer and defining the electrothermal conversion portion and a protecting film covering at least the electrothermal conversion portion and the wiring of the heat generating resistor layer. In the liquid ejection head substrate, the wiring is made of an alloy containing Al as a main component and Cu and having an average crystal grain size of 300 nm or less.

Liquid ejection head substrate, method of manufacturing same and liquid ejection head

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Yokohama, Japan

Yuzuru Ishida