Matsushita Electric Industrial Co., Ltd.

Yuzuru Inaba

Kiyoshi Imai

Hideaki Watanabe

Hiromi Kinoshita

Takashi Sasaki

Hiroyuki Miyake

Eiichiro Terayama

Naoichi Chikahisa

Hitoshi Nakahira

Toshiyuki Kinou

Akira Iizuka

Osamu Ikeda

Shunji Hashimoto

Naoithi Thikahisa

An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Mounting apparatus for electronic component

An applicator has a rubber heater ( ) attached to the outer peripheral surface of the application member ( ) in the vicinity of a nozzle ( ). Thereby, the temperature in the vicinity of the nozzle ( ) is controlled by a control unit by detecting the temperature using a thermal resistor ( ). A change in the viscosity of the viscous material ( ) is prevented by keeping the temperature substantially constant, so that the volume of the viscous material from the nozzle ( ) is stabilized.

Apparatus for applying viscous material

The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member ( ) having a screw portion ( ) inserted therein is rotated by a rotating device ( ), so that a nozzle stopper ( ) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed. The rotation of the screw portion is controlled in accordance with a viscosity of the adhesive, thus achieving the application in a required application diameter through a simple operation.

Apparatus and method for applying viscous fluid

An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Method and apparatus for application of adhesive

A method and apparatus for applying an electronic component adhesive with a minimum length of time for setting a proper application condition. Variation of application shapes of each type of the adhesive is monitored under various different application conditions and its resultant data is saved. When a desired application shape is inputted, the application nozzles are automatically controlled to apply desired doses of the adhesive under an optimum application condition which is defined by retrieving the data previously stored. Also, various different application shapes for bonding respective electronic components may be determined and saved in advance, so that a proper application condition can be automatically determined by retrieving the data on the application shapes when a desired electronic component is selected.

Method and apparatus for applying an electronic component adhesive

An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

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Kofu, Japan

Yuzuru Inaba