Hitachi, Ltd.

Hitachi Tokyo Electronics Co., Ltd.

Yuzo Taniguchi

Masahito Ijuin

Kazuhiko Matsuoka

Hiroto Nagatomo

Masao Sakata

Seiji Ishikawa

Ryohei Satoh

Akira Yabushita

Sadao Shimoyashiro

Michifumi Kawai

Isao Miyazaki

Masashi Nishiki

Jun Nakazato

Kimio Muramatsu

Yuichi Ohyama

Shigeaki Suzuki

Tsutomu Okabe

Osamu Satou

Yuzaburo Sakamoto

Shuichi Hanashima

Taizo Hashimoto

Yutaka Ebara

Tomohiko Murase

Tomohiro Murase

Makoto Fukushima

Minori Noguchi

Yoshimasa Ohshima

Yukio Kembo

Hiroshi Morioka

Michio Tanimoto

Mikihito Saito

Hidetoshi Nishiyama

Masahide Harada

Kenji Sekine

Kenji Watanabe

Yoshitoshi Ito

Masataka Shiba

Hideaki Sasaki

Tetsuya Hayashida

Shigeharu Kimura

Hiroshi Kondoh

Hideyuki Nagaishi

Hideaki Doi

Kosuke Inoue

Mitsugu Shirai

Terumi Nakazawa

Chusuke Munakata

Toru Nishikawa

Kazuo Matsuura

Ryohei Sato

Yoshiharu Shigyo

Kyo Suda

Kanji Kinameri

Shinobu Hase

Fumiaki Endo

Keigo Kamozaki

Tooru Fukui

Yoshiichi Hori

Takahiro Kamagata

A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

Semiconductor device producing method, system for carrying out the same and semiconductor work processing apparatus included in the same system

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Inspection data analyzing system

A gas discharge display device having a first substrate, a plurality of first electrodes having a substantially rectangular form being arranged on the first substrate, a plurality of second electrodes, respective ones of the plurality of second electrodes being formed on respective ones of the plurality of first electrodes, and each of the plurality of second electrodes having an extension extending beyond an end of a respective one of the plurality of first electrodes on which respective ones of the plurality of second electrodes are formed and in an oblique direction therefrom. The extension of the plurality of second electrodes extend beyond opposite ends of alternate ones of the plurality of first electrodes.

Method of making gas discharge display panel and gas discharge display device

A gas discharge display device comprising a front side substrate having a plurality of first electrodes and a back side substrate having a plurality of second electrodes, wherein at least said first electrodes or second electrodes are formed by wet etching using a resist made of an inorganic material, is excellent in the ability to suppress the breakage of wiring in electrodes.

Wiring substrate and gas discharge display device

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

Process for manufacturing electronic circuit devices

A method of making a gas discharge display panel and a gas discharge display device using laser processing so that the manufacturing time to form wiring on a substrate thereof is significantly reduced. In order to achieve this, the gas discharge display panel is provided with a first substrate having a plurality of first electrodes and a plurality of second electrodes, and the first electrodes are laser processed to have a substantially rectangular shape. The second electrodes are formed on the first electrodes, and a second substrate having a plurality of third electrodes which is opposed to the first substrate is provided.

Gas discharge display panel and gas discharge display device having electrodes formed by laser processing

Wiring substrate and gas discharge display device that includes a dry etched layer wet-etched first or second electrodes

A method of making a gas discharge display panel including the steps of providing a first substrate having a plurality of first electrodes and a plurality of second electrodes, laser processing said first electrodes into a rectangular form, forming the second electrodes on the first electrodes and providing a second substrate having a plurality of third electrodes and being opposed to the first substrate.

Wiring substrate and gas discharge display device and method therefor

A high-frequency transmitter-receiver apparatus includes a transceiver circuit realized in a planar structure by a dielectric substrate and a semiconductor chip and a planar antenna formed on a dielectric substrate are provided on front and rear surfaces, respectively, of a single electrically conductive base plate. Signal lines of the planar circuit and the planar antenna are electrically interconnected by a coaxial line which extends through said base plate.

High-frequency transmitter-receiver apparatus for such an application as vehicle-onboard radar system

Inspection system and method using separate processors for processing different information regarding a workpiece such as an electronic device

Growing community of inventors

Kodaira, Japan

Yuzo Taniguchi