Nec Corporation

Japan E.m. Co., Ltd.

Nec Toppan Circuit Solutions, Inc.

Nippon Electric Co., Ltd.

Nihon University

Yuzo Shimada

Naoji Senba

Sakae Kitajo

Kazuaki Utsumi

Nobuaki Takahashi

Mikio Oda

Takao Yamazaki

Takayuki Suyama

Shintaro Yamamichi

Yoshimasa Tanaka

Toru Mori

Hikaru Kouta

Akinobu Shibuya

Kazuhiro Ikuina

Hideo Kikuchi

Shinichi Hasegawa

Keiichiro Kata

Kazuhiko Futakami

Koji Soejima

Hirokazu Tohya

Masanori Suzuki

Ichiro Hazeyama

Shiro Yoshida

Masahiko Fujiwara

Yoshinobu Kaneyama

Masaru Terashima

Akeo Katahira

Jun Ishida

Yutaka Saito

Yasuhiro Sasaki

Koji Matsui

Junichi Sasaki

Mitsuo Saito

Tadanori Shimoto

Manabu Bonkohara

Osamu Myohga

Kenji Uchiyama

Mitsuru Yamamoto

Kazuyuki Mikubo

Masataka Itoh

Kenichi Tokuno

Akihiro Dohya

Yoshitsugu Funada

Shuzo Fujii

Koetsu Tamura

Masataka Ito

Ryo Maniwa

Teruyuki Ikeda

Yasuhiro Kurokawa

Hideo Takamizawa

Hideki Kusamitu

Yoshio Matsumoto

Katsumasa Hashimoto

Yoshinobu Kobayashi

Makoto Ohtsuka

Takumi Yamamoto

Akira Hatase

Ikushi Morizaki

Shinichi Tamabayashi

Seiji Suda

Ikusi Morizaki

The present invention aims at providing a three-axis motion table capable of ensuring smooth rotations around three rotation axes orthogonal to each other and decreasing an overall weight. The three-axis motion table according to the present invention has an outside frame (), an (e.g., approximately square) intermediate frame (), and an (e.g., approximately square) inside frame (). The outside frame () is rotatably mounted around a first rotation axis () by means of a pair of both-end supporting legs (). The intermediate frame () is rotatably mounted around a second rotation axis () by means of the outside frame (). The inside frame () is rotatably mounted around a third rotation axis () by means of the intermediate frame (). The inside frame () has a holding mechanism for a tested model (J). One of the both-end supporting legs () is provided with a first motor (M) to rotate the outside frame (). The outside frame () is provided with a second motor (M) to rotate the intermediate frame (). The intermediate frame () is provided with a third motor (M) to rotate the inside frame (). According to the above-mentioned configuration, the first through third motors (Mthrough M)rotate. The inside frame () holding the tested model (J) rotates in the space inside the intermediate frame (). The intermediate frame () rotates in the space inside the outside frame (). In this maimer, rotations are provided around the three rotation axes () orthogonal to each other. The pair of both-end supporting legs () works as a base for supporting the entire three-axis motion table (A). The pair of both-end supporting legs () is more stable than a base (B in FIG.) according to the conventional technology using only one vertical rotation axis for supporting one end. The pair of both-end supporting legs () is capable of miniaturization and weight saving.

Three-axis motion table

There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.

Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk

After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.

Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board

A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leadselectrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.

Semiconductor device with decoupling capacitors mounted on conductors

An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.

Optical waveguide board and optical module

Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip

Transfer apparatus for arraying small conductive bumps on substrate and/ or chip

An optical path control apparatus includes a first substrate. A second substrate is movably provided for the first substrate. A mirror section is provided on the second substrate. A driving section moves the second substrate such that a first optical path of input light to the mirror section is optically connected to one of a plurality of second optical paths.

Optical path control apparatus with mirror section, and manufacturing method for the same

A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.

Semiconductor device and method for packaging same

A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump&rarr;interposer&rarr;BGA bump&rarr;heat radiating via&rarr;heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.

Semiconductor device packaging structure

A semiconductor device provided with a thin film capacitor having a small equivalent series inductance is provided, which can be operated at a high frequency range and contributes to size reduction of the electronic devices. The semiconductor device comprises a device formed on a silicon substrate , interlayer insulating films , and , wiring blocks including a power source wire block and a ground wire block, and a thin film capacitor formed on an uppermost insulating layer. The thin film capacitor comprises a lower electrode connected to the ground wire block through a contact , an upper electrode which is connected to the power source wire block through a contact , and which extends above the lower electrode , and a dielectric layer which is inserted between the lower and the upper electrodes.

Semiconductor device, and thin film capacitor

A capacitor has a lower electrode, a dielectric thin film, an upper electrode, and an insulation cover layer formed on an insulation substrate made of an organic film or a ceramic material, and through holes formed at positions corresponding to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package, with electrodes for connection to input and output pads of a semiconductor element or to input and output terminals of a semiconductor package provided within through holes. In a method for mounting the capacitor, the capacitor is interposed between a flip-chip connected semiconductor element and a mounting substrate.

Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same

A three-dimensional semiconductor device includes a cylindrical heat sink, wherein a CPU is provided on a substantially center of an inner bottom surface of the cylindrical heat sink, semiconductor chips are respectively mounted on an outer peripheral surface and an inner peripheral surface of the cylindrical heat sink, and the CPU is connected to an upper heat sink.

Three-dimensional semiconductor device and method of manufacturing the same

The present invention provides a photo-electric combined substrate comprising an electric interconnection part having an electric interconnection layer and an electric insulating layer as well as an optical waveguide part consisting of a core and a clad, where the electric insulating layer in the electric interconnection part and the optical waveguide part are made of the same material; a ceramic substrate comprising an optical device and an electric device where a ceramic substrate has a concave where the concave is filled with a resin, and where at least an optical device is mounted on the ceramic substrate while an electric device on the resin in the substrate concave; and an optical waveguide comprising a core and a clad having a refractive index lower than that of the core, where the core is made of a fluorene-unit-containing epoxy acrylate resin.

Photo-electric combined substrate, optical waveguide and manufacturing process therefor

After an optical element and more preferably both an optical element and an electrical element are mounted on a substrate an upper clad of optical waveguide is formed, covering these elements, and thereby a structure of hermetic seal is achieved through the use of the upper clad

Optical module and manufacturing method thereof

Growing community of inventors

Tokyo, Japan

Yuzo Shimada