Innolight Technology (suzhou) Ltd.

Innolight Technology Pte. Ltd.

Jiangsu University

Yuzhou Sun

Long Chen

Dengqun Yu

Xiangzhong Wang

Donghan Wang

Zhenzhong Wang

Xiongfei Zhai

Chao Zhang

Weilong Li

Kewu Wang

Xigui Fang

Meng Fang

Weilong Lee

Xiaoming Xu

Liang Luo

Wenkai Tu

Jinan Gu

Chih-Kuo Tseng

Xudong Ren

Xianyao Li

Yue Xiao

Lan Chen

Xinzhou Zhang

Xiaoyao Li

Yonggan Zhang

Jiang Chang

Xinjun Zhou

Zhaopeng Tong

Wangfan Zhou

Guoliang Chen

An optical module package structure, comprising a housing, and a circuit board, a first device, and a sub-board that are packaged in the housing. The housing comprises a first housing and a second housing. An outer surface of the first housing is a main heat-dissipation surface. The first device is electrically connected to the circuit board by means of the sub-board. A first signal line is provided on the circuit board. An extension section is provided on the sub-board. The sub-board partially overlaps the circuit board, and is connected to same. The first signal line extends to the extension section. The surfaces of the sub-board and the circuit board which partially overlap each other face opposite directions. The first device is electrically connected to the extension section. The first device is provided with a heat-dissipation surface. The heat-dissipation surface faces the first housing, and is thermally connected to same.

Optical module package structure

An optical component includes an active optical surface, a back surface opposite the active optical surface, and an installation surface connecting the active optical surface and the back surface. At least one of the active optical surface or the back surface is formed with a metal layer on at least a portion of an area located away from a center of the at least one of the active optical surface or the back surface.

Optical component, optical assembly, optical module, and manufacturing method thereof

A tunable laser includes a housing having a sealable accommodating cavity, an optical interface and an electrical interface disposed on the housing, a tunable semiconductor laser apparatus, a splitter component, and a photodetector. The tunable semiconductor laser apparatus is disposed in the accommodating cavity for emitting an optical signal whose wavelength is tunable. An electrical signal inputted through the electrical interface controls the tunable semiconductor laser apparatus to emit the optical signal. The optical signal is outputted through the optical interface. The splitter component and the photodetector are disposed outside the housing. The optical signal is split into at least two beams of light by the splitter component after the optical signal is outputted through the optical interface. The photodetector is configured to receive one of the beams of light to monitor the optical signal emitted by the tunable semiconductor laser apparatus.

Tunable laser assembly including tunable semiconductor laser apparatus and photodetector outside of laser housing

An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

Optical module

An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes an optoelectronic chip arranged on the heat sink apparatus. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The heat sink apparatus is connected to the second surface. The opening is located near a center of the printed circuit board. The optoelectronic chip is arranged in the opening.

A photodetector with an integrated reflective grating structure includes a substrate, an active layer disposed on the substrate, and a grating structure disposed between the substrate and the active layer. A first doped region is formed on the substrate at a location near the grating structure. A second doped region is formed on a surface of the active layer away from the grating structure. The doping type of the second doped region is different from that of the first doped region.

Photodetector with integrated reflective grating structure

An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

A receiver optical assembly includes: an optical platform, a receiver optical port and a wavelength division multiplexer being arranged along an optical path on the optical platform; a circuit board, a photodetector array being disposed on the circuit board; a mounting block, a focusing lens and an optical path shifter being disposed on t the mounting block, the mounting block being fixed on the circuit board, and the optical path shifter being placed above the photodetector array. Incident light containing a multi-channel optical signal enters through the receiver optical port, and the wavelength division multiplexer divides the incident light into a plurality of single-channel optical signal beams. The single-channel optical signal beams are coupled to photodetectors on the photodetector array after passing through the focusing lens and the optical path shifter on the mounting block.

Receiver optical assembly and assembly method thereof

The present invention relates to an apparatus and method for additive manufacturing by ultra-high-speed laser cladding. The apparatus includes a laser generator, a beam expander, and a reflector. A light exit path of the reflector is arranged facing a cladding nozzle. The cladding nozzle is connected to a powder pool through a hose and a pump in succession. A matrix is arranged below the cladding nozzle. The matrix is located on a rotary platform. A main stepping motor is fixedly mounted below the rotary platform. The main stepping motor is fixed on a lifting platform. A laser rangefinder is arranged above the matrix. During the laser cladding-based additive manufacturing process, the ultrasonic vibration device, the infrared camera, the high-speed camera, the laser rangefinder, and the radiological inspection system are turned on to monitor the laser cladding process in real time.

Apparatus and method for additive manufacturing by ultra-high-speed laser cladding

An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes a first optoelectronic chip and a second optoelectronic chip that are both arranged on the heat sink apparatus. The first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The second optoelectronic chip is arranged at the opening. The second optoelectronic chip is arranged separately from the first optoelectronic chip.

An optical module includes a housing extending in a lengthwise direction, as well as a main circuit board and an optical receiver assembly disposed in the housing. A plane on which the main circuit board is located is parallel to the lengthwise direction of the housing. The optical receiver assembly includes a receiver-end fiber optic port, at least two sets of receiver-end photoelectronic chips arranged side by side along the lengthwise direction, and a receiver-end optical component set including an optical demultiplexer and at least two coupling components located at an exit end of the optical demultiplexer. The at least two coupling components are arranged side by side along the lengthwise direction, and have different distances, respectively, to the plane on which the main circuit board is located along a first direction perpendicular to the plane on which the main circuit board is located.

A waveguide photoelectric detector, comprising: a substrate comprising a silicon layer, the silicon layer having a silicon waveguide formed thereon; an active layer dispose on the silicon waveguide, the active layer having a first doped region formed thereon; a horizontal PIN junction formed at an area of the silicon layer below the active layer, the horizontal PIN junction comprising a second doped region, an intrinsic region, and a third doped region. A doping type of the second doped region is the same as that of the first doped region. One end of the second doped region near the intrinsic region is connected to the first doped region. The third doped region and the first doped region form a vertical PIN junction.

Waveguide photoelectric detector

An optical assembly includes a carrier plate, a light emitting element and a lens component disposed on the carrier plate, and a securing block. The securing block has a first surface and a light-passing portion that are located on an optical path of an output light from the light emitting element. The lens component includes a lens portion and a connecting portion. The lens portion is located on the optical path. The connecting portion has a second surface facing the first surface of the securing block. A bottom surface of the securing block is bonded to the carrier plate. The lens component is secured onto the carrier plate by means of bonding between the second surface and the first surface of the securing block. A clearance space is present between the lens portion and the light-passing portion so that the lens portion does not contact the securing block.

Growing community of inventors

Jiangsu, China

Yuzhou Sun