Intel Corporation

Yuying Wei

Nisha Ananthakrishnan

Saikumar Jayaraman

Edvin Cetegen

Yiqun Bai

Vipul V Mehta

Arjun Krishnan

Suriyakala Ramalingam

Shan Zhong

Ziyin Lin

Yonghao Xiu

Sivakumar Nagarajan

Sushrutha Reddy Gujjula

Beverly J Canham

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. An encapsulant is over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.

Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill.

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby

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Chandler, AZ, United States of America

Yuying Wei