Shanghai Micro Electronics Equipment (Group) Co., Ltd.

Yuying Gao

Wei Wei

A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate () and a second fixation plate (), respectively. The device includes: a mounting plate (), disposed at an outer side of one of the first () and second () fixation plates; a connecting rod assembly () fixed around a center position of the mounting plate (), the connecting rod assembly () connected to the one of the first () and second () fixation plates sequentially via a sliding pair () and a spherical pair () connected to the sliding pair (); and at least three elastic assemblies () disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate () and the one of the first () and second () fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.

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Shanghai, China

Yuying Gao