Intel Corporation

Yuyang Xia

Jun Zhang

David Shia

Jin Yang

Lianchang Du

Javier Avalos Garcia

Chia-Pin Chiu

Damion T Searls

Richard J Dischler

Barrett M Faneuf

Bijoyraj Sahu

Eric W Buddrius

Mohanraj Prabhugoud

Nishi Ahuja

Jessica Gullbrand

Kenan Huseyin Arik

Prabhakar Subrahmanyam

Shaorong Zhou

Catharina Biber

Ying-Feng Pang

Michael Berktold

Kristin L Weldon

Yi Xia

Jimmy Chuang

Brendan T Pavelek

Victor Polyanko

Carlos Alvizo Flores

Andres Ramirez Macias

Minh T D Le

Jason Crop

Adriana Lopez Iniguez

Min Wu

Luz Karine Sandoval Granados

Mark Bianco

Yuehong Fan

Yuan Li

Xiaojin Gu

Xicai Jing

Yuan-Liang Li

Maria De La Luz Belmont

Oscar Farias Moguel

Shengzhen Zhang

Bergen Anderson

John Raatz

Jeffrey Ryan Conner

Samer Melhem

Wenqing Lv

Chao Zhou

Dan Liu

Carrie Chen

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

Boiling enhancement structures for immersion cooled electronic systems

Disclosed embodiments are related to techniques for powering compute platforms in low temperature environments. Embodiments include a preheating stage that is added to a power up sequence. The preheating stage may include a force-on stage and a force-offstage. During the force-on stage, all power rails of target components are forced to an ON state so that the target components consume current. When a target operating temperature is reached, the power rails of the target components are turned off, which causes the target components to revert back to their initial (pre-boot) state allowing the normal boot process to take place. Since the target components are now heated up, the boot process can execute faster than when the target components were cold. Other embodiments may be described and/or claimed.

Power management techniques for computing platforms in low temperature environments

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Shanghai, China

Yuyang Xia