Dow Global Technolgoies LLC

Yuyan Li

Hong Yang

Weiming Ma

Chao He

Yunfeng Yang

Hongyu Chen

Brian M Habersberger

Yabin Sun

Yonghua Gong

Kainan Zhang

Jeffrey Morris Cogen

Bharat Indu Chaudhary

Timothy James Person

Lisa S Madenjian

A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*10ohm·cm; (B) a hydrophobic-treated fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.

PV module with film layer comprising hydrophobic-treated fumed silica

A composition comprising the following: a) an ethylene/alpha-olefin/interpolymer; b) a peroxide; c) a “Si-containing compound” selected from the following (i) through (v): (i), where each R is independently selected from a C1-C3 alkyl, and n is from 1 to 16; (ii), where each R is independently methyl or ethyl, and n is from 1 to 18; (iii), where each R is independently methyl or ethyl; (iv) a vinyl oligomericsiloxane; or (v) any combination of (i) through (iv).

Ethylene/alpha-olefin interpolymer compositions with high glass adhesion

The present disclosure relates to an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a monocyclic organosiloxane of formula (I).

Polyolefin compositions for photovoltaic encapsulant films

A composition for use as a film layer comprises (A) an olefin-based polymer having a volume resistivity greater than 5.0*10ohm·cm; (B) a hydrophilic fumed silica; (C) an alkoxysilane; (D) an organic peroxide; and, optionally, (E) from 0 wt % to 1.5 wt % of a crosslinking co-agent.

PV module with film layer comprising hydrophilic fumed silica

The present disclosure relates to a curable composition for an encapsulant film, the curable composition comprising: (A) a polyolefin; (B) a fumed alumina; (C) an organic peroxide; (D) a silane coupling agent; (E) a crosslinking co-agent; and, optionally, (F) an additive component comprising a UV stabilizer, wherein the polyolefin has a volume resistivity of less than 4.0E+15 ohm·cm. The present disclosure further relates to an encapsulant film made from such a curable composition and a PV module containing such an encapsulant film.

Photovoltaic encapsulant films comprising fumed alumina

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

Non-polar ethylene-based compositions with triallyl phosphate for encapsulant films

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a compound of Structure I wherein R-Reach is independently selected from the group consisting of hydrogen, a C-Chydrocarbyl group, a C-Csubstituted hydrocarbyl group, and combinations thereof. 

Non-polar ethylene-based polymer compositions for encapsulant films

This disclosed is an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a silane compound of formula (I). This further disclosed is a process for preparing said encapsulant film.

The present disclosure relates to an encapsulant film made from a curable composition comprising: (A) a polyolefin polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a monocyclic organosilazane of formula (I).

Growing community of inventors

Shanghai, China

Yuyan Li