Toyota Jidosha Kabushiki Kaisha

Yuya Takano

Yasuji Taketsuna

Eisaku Kakiuchi

Masahiro Morino

Fumiki Tanahashi

Katsuhiko Tatebe

Tomohiro Takenaga

A semiconductor device may include coolers, semiconductor modules, and a pair of connecting pipes. The coolers are arranged in a line and each of which includes a first flow path. Each of the semiconductor modules is interposed between a corresponding pair of the coolers. Each of the connecting pipes communicates with the adjacent coolers. A pair of coolant holes may be provided at one of the coolers located at one end in the stacking direction. A pair of second flow paths may extend respectively from the coolant holes to one of the coolers located at other end in the stacking direction. A bolt-head retainer and an internally threaded portion may be provided in each second flow path, the bolt-head retainer retaining a head of a bolt, and the internally threaded portion fixing the bolt. The coolers between the bolt-lead retainers and the internally threaded portions are fixed by the bolts.

Semiconductor device

A cooler includes: a fin having a coolant inflow port; and a nozzle configured to eject the supplied coolant toward the coolant inflow port. The nozzle includes a flow passage wall, a tip end, a pressure receiving portion and a deformation portion. The tip end provides a coolant supply hole that ejects the coolant flowing through the flow passage. The pressure receiving portion is configured to be provided between the flow passage wall and the coolant supply hole, and to receive force in an ejection direction of the coolant. The deformation portion is configured to be provided either of between the flow passage wall and the pressure receiving portion and in the pressure receiving portion, and to displace the coolant supply hole in the ejection direction of the coolant in response to the force in the ejection direction of the coolant, the force being received by the pressure receiving portion.

Cooler

A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit.

Semiconductor device and manufacturing method of semiconductor device

In a heat exchanger, fins are simply and accurately positioned in place and heat is efficiently exchanged without increasing manufacture cost, and the plurality of corrugated plate-like fins are disposed in the flow direction of a coolant in a housing. The heat exchanger has: connecting parts, which connect together the adjacent fins among the fins; protrusions formed on the connecting parts; and positioning holes for positioning the fins formed in the housing. The adjacent fins are disposed at predetermined intervals in the coolant flow direction with a predetermined offset amount in the direction that orthogonally intersects the coolant flow direction by fitting the protrusions in the positioning holes.

Heat exchanger and method for manufacturing same

Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.

Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame. The first frame member is provided with elastically deformable projections (elastically deformable portions) along an arrangement surface of the outer surface on which the insulating plates (intervening members) are arranged.

Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device

A heat exchanger is provided with a cooling fin including a plurality of fin portions and a base portion supporting the fin portions, and a plurality of pins press-fitted into the fin portions. In the heat exchanger the pins each having a wider width than each space between the fin portions formed in advance in parallel straight shapes are press-fitted into the spaces in a direction from a top end of each fin portion toward the base portion. Accordingly, the fin portions are formed into corrugated shapes by plastic deformation, thereby fixing the pins between the fin portions in positions apart from the base portion. In each space the pins are arranged at intervals in a longitudinal direction of each space. The pins arranged in adjacent spaces are placed with a displacement in alternating pattern.

Growing community of inventors

Nishio, Japan

Yuya Takano