Kabushiki Kaisha Toshiba

Yuya Suzuki

Hiroshi Maejima

Hidehiro Shiga

Toshiaki Edahiro

Toshiki Hisada

Dai Nakamura

Tomonori Kurosawa

Rieko Tanaka

Yoshikazu Hosomura

A semiconductor memory device includes a first block including a first memory string that includes a first memory cell and a first select transistor, a second block including a second memory string that includes a second memory cell and a second select transistor, a source line that is connected to the first memory string and the second memory string, and a controller that applies a source line voltage to the source line and a first voltage to a gate of the second select transistor during a program operation in which data is written to the first memory cell, the first voltage being greater than ground voltage and less than or equal to the source line voltage.

Semiconductor memory device

A nonvolatile semiconductor memory device includes an array of memory cells arranged at the position intersecting positions of the word line and the bit line, a control signal generating circuit for carrying out a writing operation including a program for carrying out writing in the memory cell and a verification for verifying whether the data has been correctly written in the memory cell by the program, and a cell source monitoring circuit for detecting a voltage of the source line connected to the memory cell during the writing operation. The control signal generating circuit directly shifts the source line voltage at the time of program to a lower voltage necessary at the time of verification after the end of the program, based on the voltage the source line detected by the cell source monitoring circuit.

Nonvolatile semiconductor memory device

A memory includes plurality of word lines extending in a first direction, plurality of bit lines extending in a second direction to intersect with the word lines, and a memory cell array including plurality of memory cells connected to the word lines and the bit lines. Plurality of sense amplifiers include detectors configured to detect data transmitted from the memory cells to sense nodes via the corresponding bit lines, and capacitors connected between the sense nodes and a reference potential, respectively, and are provided to be arranged in the second direction from at least a side of one ends of the bit lines. Each of k capacitors corresponding to k detectors, where k is equal to or greater than 2, has a width corresponding to widths of the k detectors, the k capacitors are arranged in the second direction, and the k detectors are arranged in the first direction.

Semiconductor storage device

According to one embodiment, a semiconductor device includes memory cells, bit lines, a write circuit, and sense amplifiers. The bit lines are connected to the memory cells. The sense amplifiers are configured to bias the bit line to which the selected memory cell is connected, to a first voltage until the threshold of the selected memory cell reaches the value of a first write state. Then, when the threshold of the selected memory cell reaches the value of the first write state, the bit line is biased to a second voltage higher than the first voltage. When the threshold of the selected memory cell reaches the value of a second write state, the bit line is continuously biased to a third voltage higher than the second voltage. Bit lines connected to unselected memory cells corresponding to the memory cells other than the selected one are biased to the third voltage.

Nonvolatile semiconductor memory device and write method for the same

A semiconductor storage device has a sense amplifier. The sense amplifier includes a first lower interconnection; a second interlayer insulation film formed on the first interlayer insulation film and top of the first interconnection; a contact interconnection formed in a direction perpendicular to a substrate plane of the semiconductor substrate so as to pass through the second interlayer insulation film, and connected to the first lower interconnection; a first upper interconnection formed on the second interlayer insulation film and connected to the contact interconnection disposed under the first upper interconnection; a dummy contact interconnection formed in a direction perpendicular to the substrate plane of the semiconductor substrate in the second interlayer insulation film, and adjacent to the contact interconnection; and a second upper interconnection formed on the second interlayer insulation film so as to extend in the first direction, and connected to the dummy contact interconnection disposed under the second upper interconnection.

A nonvolatile semiconductor memory device comprises: a memory cell array including a plurality of memory cell units each including memory cells, a plurality of bit lines, and a common source line; a sense amplifier operative to read data from a selected memory cell; a control circuit operative to control a read operation of the sense amplifier; and a cell source monitoring circuit operative to detect a voltage of the common source line, compare the detected voltage of the common source line with a reference voltage, and output a read control signal. The sense amplifier is configured to read data from the selected memory cell through at least two cycles. The control circuit is configured to perform control to determine whether the data reading is to be ended after a first reading cycle or a second reading cycle is to be carried out, based on the read control signal.

Growing community of inventors

Yokohama, Japan

Yuya Suzuki