Nitto-Denko Corporation

Hitachi Chemical Company, Ltd.

Yuya Kitagawa

Hironobu Machinaga

Takehiro Ui

Kou Uemura

Kazuaki Sasa

Hiroichi Ukei

Tomoyuki Kasagi

Kazuto Yamagata

Shimpei Yakuwa

Shunji Imamura

Yuki Takeda

Syunji Imamura

Yuta Ono

Mitsuaki Fusumada

Hironori Kobayashi

Teruyoshi Hasegawa

A plate-like composite material in which peeling of a conductor layer and the like serving as wiring is less liable to occur is provided. The plate-like composite material includes: a pore-containing layer, which contains a fluororesin and a filler, and which contains pores; and a resin layer containing a fluororesin bonded to one surface, or each of both surfaces, of the pore-containing layer, wherein the pore-containing layer includes, in a vicinity of an interface with the resin layer, a high resin content region, which contains the fluororesin in a content higher than a content in a remaining region of the pore-containing layer, and which contains the pores in a content lower than a content in the remaining region, and wherein the high resin content region has a thickness starting from the interface of from 0.20 &#x3bc;m to 10 &#x3bc;m.

Plate-like composite material

For the purpose of providing an electromagnetic wave absorber usable for radar having a high revolution and sufficiently adaptable to a plurality of radars different in frequency, the bandwidth of a frequency band in which an electromagnetic wave absorption amount is not less than 20 dB is not less than 2 GHz, within a frequency band of 60 to 90 GHz.

Electromagnetic wave absorber

For the purpose of providing an electromagnetic wave absorber capable of holding excellent performance over a long period of time, the electromagnetic wave absorber includes: a dielectric layer B including a polymer film and having a first surface and a second surface; a resistive layer A formed on the first surface of the dielectric layer Band containing indium tin oxide as a main component; and an electrically conductive layer C formed on the second surface of the dielectric layer B and having a sheet resistance lower than that of the resistive layer A, wherein the indium tin oxide in the resistive layer A contains 20 to 40 wt. % of tin oxide based on the total weight of the indium tin oxide.

Electromagnetic wave absorber and molded article equipped with electromagnetic wave absorber

To obtain an insulating resin material serving as a material achieving both an excellent low specific dielectric constant and an excellent low linear thermal expansion coefficient, which has heretofore been difficult to obtain, and a metal layer-equipped insulating resin material and a wiring substrate each using the insulating resin material, provided is an insulating resin material, including: porous inorganic aggregates each having pores defined by a plurality of fine particles; and fibrils formed of polytetrafluoroethylene, wherein the fibrils are each multidirectionally oriented, wherein at least one of the porous inorganic aggregates and the fibrils are connected to each other, and wherein the insulating resin material is formed of a micro network structure having a porosity of 50% or more.

Insulating resin material, metal layer-equipped insulating resin material using same, and wiring substrate

An epoxy resin composition, comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a carboxylic acid compound that satisfies at least one selected from the group consisting of the following A, B and C below: A: having at least one carboxy group and at least one hydroxy group; B: having at least two carboxy groups; and C: having a structure in which two carboxy groups are condensed by dehydration.

Epoxy resin composition and electronic component device

Growing community of inventors

Ibaraki, Japan

Yuya Kitagawa