Konica-minolta Holdings, Inc.

Yuya Hirao

Jun Yamada

Masakazu Okada

Naoki Masazumi

Disclosed is a method for manufacturing a display panel, which employs a vacuum bonding method. A display material is dispensed such that the height distance from the upper surface of a lower substrate to the top of the display material is larger than the height distance from the surface of either upper or lower substrate on which the seal pattern is formed to the apex of the seal pattern. The upper substrate is placed at a position where the upper substrate and the top of the display material in the height direction are in touch with each other and the seal pattern on one substrate is not in touch with the other substrate, then, air is released. Thus, volatilization of the display material is reduced easily at small cost to prevent drying of the surface of the display material, and the display qualities can be prevented from being degraded.

Method for manufacturing display panel

A method for producing an organic thin film transistor having, on a substrate, a source electrode, a gate electrode, a drain electrode, an insulating layer and an organic semiconductor layer. The method has a step of forming the source electrode and the drain electrode such that one of the source electrode and the drain electrode which is an inner-located electrode has an outer circumference which is circular or polygonal and that the other electrode which is an outer-located electrode has an inner circumference facing the outer circumference of the inner-located electrode, the inner circumference being of a shape which is substantially concentric with the outer circumference of the inner-located electrode. The method also has a step of forming the organic semiconductor layer for connecting the source electrode and the drain electrode to each other by a process of dropping an organic semiconductor material.

Method for producing an organic thin film transistor and an organic thin film transistor produced by the method

Disclosed is a method of forming an organic semiconductor layer comprising the steps of preparing a substrate having a groove formed on the surface, applying, to the surface of the substrate, a droplet of an organic semiconductor liquid in which an organic semiconductor material is dissolved or dispersed in a solvent, and drying the droplet to form the organic semiconductor layer, wherein the droplet is applied to a position of the substrate where a part of the circumference of the droplet is introduced into the groove.

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Koka, Japan

Yuya Hirao