Murata Manufacturing Co., Ltd.

Yuya Dokai

Noboru Kato

Satoshi Ishino

Nobuo Ikemoto

Ikuhei Kimura

Tsuyoshi Mukai

Hiromi Murayama

Masato Nomura

Takeshi Kataya

Kazuaki Higashibata

Koji Shiroki

Takahiro Baba

Mikiko Tanaka

Takahiro Yamaguchi

Nihei Kaishita

Makoto Takeoka

Hiroshi Nonogaki

Kazuyuki Ikeda

Ryohei Goto

Masahiro Ozawa

Yuki Ito

Tsutomu Ieki

Isamu Morita

Shinya Oguri

Noburo Kato

Mikiko Kimura

Shigeyuki Shioya

In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.

Transmission line and electronic device

A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.

Multilayer substrate

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

Radio IC device

A HF-band wireless communication device includes a wireless IC configured to process a radio signal, a first substrate including a first inductor pattern coupled to the wireless IC, and a second substrate which includes a coil-shaped second inductor pattern coupled in series to the first inductor pattern. An L value of the first inductor pattern is greater than an L value of the second inductor pattern, and the L value of the first inductor pattern is dominant in a resonant frequency of a resonance circuit including the first and second inductor patterns. A winding diameter of the second inductor pattern is greater than a winding diameter of the first inductor pattern, and the second inductor pattern defines a main radiating element.

HF-band wireless communication device

An RFID tag inspection method includes the steps of transmitting a measurement signal from a reader/writer simultaneously to a plurality of RFID tags arrayed on a collective base member and configured to process radio signals, receiving response waves from the individual RFID tags in a batch by the reader/writer, and determining, based on strengths and a number of received signals read by the reader/writer, whether or not the individual RFID tags are acceptable. Thus, acceptance/rejection inspection can be performed on the plural RFID tags, which are arrayed on the collective base member, in a batch.

Inspection method and inspection device for RFID tag

A wireless communication device includes a wireless IC device, a multilayer substrate including a stack of a plurality of dielectric layers, a resonant circuit that is connected to the wireless IC device and that includes a capacitance element provided in the multilayer substrate and an inductance element provided outside the multilayer substrate, and a radiation conductor connected to the resonant circuit.

Wireless communication device

An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap.

Antenna module

An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.

Wireless IC device

An antenna module includes a base including two opposing mounting surfaces, an antenna coil provided on or in the base so as to define an opening, the antenna coil having a shape that is symmetrical or substantially symmetrical with respect to a reference plane, and an IC chip and a plurality of electronic components mounted on one of the mounting surfaces and electrically coupled to the antenna coil, the IC chip and the electronic components being arranged inside the opening when viewed in plan from a normal direction of the mounting surface. At least two of the plurality of electronic components are arranged so as to be symmetrical or substantially symmetrical to each other with respect to the reference plane when viewed in plan from the normal direction.

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Nagaokakyo, Japan

Yuya Dokai