Applied Materials, Inc.

Yuxing Zhang

Amit Kumar Bansal

Tuan Anh Nguyen

Kalyanjit Ghosh

Nitin Pathak

Kaushik Comandoor Alayavalli

Badri N Ramamurthi

Daniel Hwung

Abdul Aziz Khaja

Sarah Michelle Bobek

Saket Rathi

Juan Carlos Rocha-Alvarez

Sanjeev Baluja

Ganesh Balasubramanian

Tejas Ulavi

Zhijun Jiang

Mayur G Kulkarni

Ashutosh Agarwal

Shailendra Srivastava

Shawyon Jafari

Thomas Rubio

Yusheng Zhou

Priyanka Dash

Dharma Ratnam Srichurnam

Qiang Ma

Udit S Kotagi

Exemplary semiconductor processing systems may include an output manifold that defines at least one plasma outlet. The systems may include a gasbox disposed beneath the output manifold. The gasbox may include an inlet side facing the output manifold and an outlet side opposite the inlet side. The gasbox may include an inner wall that defines a central fluid lumen. The inner wall may taper outward from the inlet side to the outlet side. The systems may include an annular spacer disposed below the gasbox. An inner diameter of the annular spacer may be greater than a largest inner diameter of the central fluid lumen. The systems may include a faceplate disposed beneath the annular spacer. The faceplate may define a plurality of apertures extending through a thickness of the faceplate.

Uniform in situ cleaning and deposition

The present disclosure relates to a cleaning assemblies, components thereof, and methods associated therewith for substrate processing chambers. In one example, a cleaning assembly for a substrate processing chamber includes a distribution ring. The distribution ring comprises a body with an inlet and an outlet. The outlet is fluidly coupled to an internal volume of the substrate processing chamber via a sidewall of the substrate processing chamber. The cleaning assembly includes a cleaning conduit configured to fluidly couple a gas manifold to the distribution ring for diverting a first portion of cleaning fluid from the gas manifold to the distribution ring.

Cleaning assemblies for substrate processing chambers

A processing chamber may include a gas distribution member, a substrate support, and a pumping liner. The gas distribution member and the substrate support may at least in part define a processing volume. The pumping liner may define an internal volume in fluid communication with the processing volume via a plurality of apertures of the pumping liner circumferentially disposed about the processing volume. The processing chamber may further include a flow control mechanism operable to direct fluid flow from the internal volume of the pumping liner into the processing volume via a subset of the plurality of apertures of the pumping liner during fluid distribution into the processing volume from the gas distribution member.

Semiconductor processing chambers and methods for cleaning the same

Embodiments herein relate to gas distribution apparatuses. In one aspect, the disclosure herein relates to a showerhead including a body having an upper surface and a lower surface. A thermal choke is disposed adjacent a perimeter of the body. The thermal choke includes a plurality of interleaved channels. One or more apertures are disposed between the upper surface and the lower surface of the body.

Horizontal heat choke faceplate design

A faceplate for a processing chamber is disclosed. The faceplate has a body with a plurality of apertures formed therethrough. A flexure is formed in the body partially circumscribing the plurality of apertures. A cutout is formed through the body on a common radius with the flexure. One or more bores extend from a radially inner surface of the cutout to an outer surface of the body. A heater is disposed between flexure and the plurality of apertures. The flexure and the cutout are thermal chokes which limit heat transfer thereacross from the heater.

Faceplate with embedded heater

Systems and methods for depositing a film in a PECVD chamber while reducing residue buildup in the chamber. In some embodiments disclosed herein, a processing chamber includes a chamber body, a substrate support, a showerhead, and one or more heaters configured to heat the showerhead. In some embodiments, the processing chamber includes a controller.

System and method for substrate processing chambers

Growing community of inventors

Santa Clara, CA, United States of America

Yuxing Zhang