Nec Corporation

Laserfront Technologies, Inc.

Yuuzou Ikeda

Keiichi Kubota

Hideyuki Ono

Ichiro Fujieda

Hikaru Kouta

Hisaya Takahashi

Masaki Tunekane

Toshinori Ishida

Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.

Laser diode module, laser apparatus and laser processing apparatus

A mobile communication terminal includes a thin AWD (arrayed waveguide display) and a winding device to roll up the display to store the display in a housing. A storage medium on which a content is copied is installed in the mobile terminal. The user pulls the display from the housing to enjoy the content. There is provided a mobile terminal, a content distribution system, a content distribution method, and a program for executing the method thereof. The mobile terminal satisfies a requirement to increase the display area and a requirement to minimize the size of the mobile terminal, and hence can distribute contents using the advantageous features.

Mobile terminal device, content distribution system, content distribution method, and program for executing method thereof

Growing community of inventors

Tokyo, Japan

Yuuzou Ikeda