Tdk Corporation

Yuuya Kaname

Manabu Ohta

Takahiro Kawahara

Yoshihiro Maeda

Hitoshi Ohkubo

Tomokazu Ito

Hokuto Eda

Kohei Takahashi

Makoto Morita

Kyohei Tonoyama

Masataro Saito

Ryo Fukuoka

Kenei Onuma

Hideto Itoh

Shigeki Sato

Masazumi Arata

Hideharu Moro

Takashi Nakagawa

In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Electronic component and coil component

A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.

Coil component

In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 &#x3bc;m) smaller than that (32 &#x3bc;m) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.

Planar coil element and method for producing the same

A coil componentis provided with coil conductorsandand a magnetic metal powder containing resin(and) covering the coil conductorsand. The magnetic metal powder containing resinincludes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 &#x3bc;m or more and 100 &#x3bc;m or less. The third average grain diameter is 2 &#x3bc;m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.

Coil component and magnetic metal powder containing resin used therefor

A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.

A coil componentincludes a substrate, a planar spiral conductorformed on a top surfaceof the substrate, a lead conductorconnected to an outer peripheral end of the planar spiral conductor, a dummy lead conductorformed on the top surface of the substrateand between an outermost turn of the planar spiral conductorand an endXof the substrateand free from an electrical connection with another conductor within the same plane, external electrodesandarranged in parallel with the top surface of the substrate, and a bump electrodeformed on a surface of the lead conductorand connects the lead conductorwith the external electrode. The external terminalsandhave a larger area than the bump electrodesandfor securing a bonding strength.

In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG.A and has improved magnetic permeability as compared to a planar coil element shown in FIG.B.

Growing community of inventors

Tokyo, Japan

Yuuya Kaname