Tanaka Kikinzoku Kogyo K.k.

National University Corporation Tokai National Higher Education and Research System

Tanaka Kikinzoku Kogoy K.k.

A School Corporation Kansai University

National Institutes for Quantum and Radiological Science and Technology

Yuusuke Ohshima

Hitoshi Kubo

Noriaki Nakamura

Yuichi Makita

Junichi Taniuchi

Hiroki Sato

Tomoko Ishikawa

Masato Kasuga

Kenjiro Koshiji

Shigeyuki Ootake

Hidekazu Matsuda

Hiroaki Takahashi

Tsukasa Torimoto

Tatsuya Kameyama

Chie Miyamae

Shingo Watanabe

Masahiro Ito

Teruhisa Iwai

Kenichi Inoue

Yoshiteru Tsuchiya

Hidenori Takanezawa

Syunsuke Kato

Hirokazu Shiraishi

Shoso Shingubara

Fumihiro Inoue

Shigeki Yamanaka

Mariko Hasegawa

Shojiro Kikuchi

Yasunori Iwai

Hirosi Noguchi

Katsumi Sato

The present invention relates to a semiconductor nanoparticle composed of a compound containing Ag, Au, S and a metal M as essential constitutional elements. In the present invention, the metal M is at least any of Al, Ga, In, Tl, Zn, Cd, Hg and Cu, and the compound has a total content of Ag, Au, S and the metal M of 95 mass % or more. In addition, a ratio (x/(x+y)) of the number of atoms of Ag to a sum of the number of atoms of Ag, x, and the number of atoms of Au, y, in the AgAuS-based multicomponent compound is preferably 0.50 or more and 0.88 or less. The semiconductor nanoparticle of the present invention has appropriate emission and extinction characteristics and is biocompatible.

Semiconductor nanoparticles composed of AgAuS-based multicomponent compound

A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.

Silver ink for low-temperature calcination

An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.

Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring

The present invention relates to a metal wiring, to be formed on a flexible substrate, including a sintered body of silver particles. The sintered body constituting the metal wiring has a volume resistivity of 20 μΩ·cm or less, hardness of 0.38 GPa or less, and a Young's modulus of 7.0 GPa or less. A conductive sheet provided with the metal wiring can be produced by applying/calcinating, on a substrate, a metal paste containing, as a solid content, silver particles having prescribed particle size and particle size distribution, and further containing, as a conditioner, an ethyl cellulose having a number average molecular weight of 10,000 or more and 90,000 or less. The metal wiring of the present invention is excellent in bending resistance with change in electrical characteristics suppressed even through repetitive bending deformation.

Metal wiring and conductive sheet both excellent in bending resistance, and metal paste for forming the metal wiring

The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.

Method for forming metal pattern

A metal ink containing metal particles including silver, a protective agent A including an amine compound, and a protective agent B including a fatty acid. The metal ink is configured such that the protective agent A includes at least one Camine compound, and the protective agent B includes at least one Cfatty acid. It is preferable that the amine compound content is 0.2 mmol/g or more and 1.5 mmol/g or less on a silver particle mass basis. In addition, it is preferable that the fatty acid content is 0.01 mmol/g or more and 0.06 mmol/g or less on a silver particle mass basis.

Metal ink

The present invention provides a method for producing silver particles, including the steps of: mixing a thermally decomposable silver compound and an amine compound to prepare a silver-amine complex as a precursor; and heating the silver-amine complex at a heating temperature equal to or higher than the decomposition temperature of the silver-amine complex to precipitate silver particles, the silver compound being silver carbonate, the amine compound being terminated with a primary amino group on at least one end and containing a predetermined hydrocarbon group R with a carbon number of 4 to 10. In the method of the present invention, silver particles with the particle size controlled to fall within the range of 20 nm to 200 nm in terms of an average particle size can be produced.HN&#x2014;R&#x2003;&#x2003;[Chemical Formula 1]

Method for producing silver particles, and silver particles produced by the method

The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.

Metal colloidal solution and method for producing the same

The present invention provides a method for producing silver particles, the method capable of adjusting the particle diameter to be within the range of several tens of nanometers to several hundreds of nanometers and also producing silver particles with a uniform particle diameter. The present invention relates to a method for producing silver particles by heating of a reaction system containing a thermally-decomposable silver-amine complex precursor, including a process of producing a silver-amine complex, a process of adding an organic compound having an amide (carboxylic amide) as a skeleton to a reaction system, and a process of heating the reaction system, in which a water content in the reaction system before the heating is 20 to 100 parts by weight relative to 100 parts by weight of the silver compound. The present invention can produce uniform silver particles while the particle diameter is controlled.

Method for manufacturing silver particles

The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 &#x212b; or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.

Method for treating substrate that support catalyst particles for plating processing

A method for supporting a catalytic metal on the surface of a carrier by bringing an aqueous catalytic metal salt solution into contact a porous carrier. The method includes the steps of: impregnating the carrier with a liquid hydrophobic organic compound before bringing the aqueous catalytic metal salt solution into contact with the carrier, and drying the impregnated carrier to volatilize the hydrophobic organic compound on the surface of the carrier, followed by bringing the carrier into contact with the aqueous catalytic metal salt solution; and then bringing a reducing agent into contact with the catalytic metal salt on the surface of the carrier to reduce the catalytic metal salt to undergo insolubilization treatment. The catalytic component is supported in a region from the surface of the carrier to a depth of 50 &#x3bc;m or more and 500 &#x3bc;m or less. The supported state of the catalytic component is made controllable, and the catalytic component can be supported in the inner part of the carrier with a suitable depth.

Method for producing surface-supported catalyst

Growing community of inventors

Tsukuba, Japan

Yuusuke Ohshima