Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Komatsu Corporation

Resonac Corporation

Yuusuke Kondou

Etsuo Mizushima

Tomio Fukuda

Takao Tanigawa

Yuki Nagai

Yuichi Shimayama

Yoshitaka Hirata

Kazunori Yamamoto

Yasushi Shimada

Hiroyuki Kuriya

Kazuhisa Otsuka

Tetsurou Irino

Masanori Yamaguchi

Tetsuroh Irino

Ken Madarame

Hikari Murai

Shin Takanezawa

Kozo Okuda

Yasuyuki Mizuno

Koji Morita

Kazunaga Sakai

Masatoshi Uchimaru

Yasushi Watanabe

An oil cooler is disposed on the vehicle body and includes a fan that creates an air flow and a housing that houses the fan. The housing has a first side surface which is disposed on the upstream side of the air flow, a second side surface which is disposed on the downstream side of the air flow, and a third side surface which is connected to the first side surface and the second side surface. The vehicle body is provided with a first passage which is disposed on the side of the first side surface, a second passage which is disposed on the side of the second side surface and on an outer edge of the vehicle body in a top view, and a third passage which is disposed on the side of the third side surface and is connected to the first passage and the second passage.

Work machine cooling unit fan housing

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.

Multilayer transmission line plate

Provided is a multilayered transmission line plate including a pair of ground layers, a differential wiring disposed between a one-sided ground layer of the pair of ground layers and the other ground layer, an insulating layer (X) disposed between the differential wiring and the one-sided ground layer, and an insulating layer (Y) disposed between the differential wiring and the other ground layer, wherein the insulating layer (X) has a layer containing a resin and not containing a glass cloth; the insulating layer (X) or the insulating layer (Y) has a layer containing a glass cloth and a resin; and the thickness of the insulating layer (X) is equal to or less than the thickness of the insulating layer (Y).

This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.

Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate

Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.

Resin composition, prepreg, laminate, and wiring board

A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.

Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device

A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.

Growing community of inventors

Tokyo, Japan

Yuusuke Kondou