Daiwa Kasei Industry Co., Ltd.

Toyota Jidosha Kabushiki Kaisha

Yuusuke Ito

Makoto Suzuki

Kentaro Furuki

Hiroaki Suzuki

Kouji Kamiya

Yousuke Ogino

Masanari Ichihara

An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness. A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.

Method for manufacturing wire harness

An objective is to provide a manufacturing method and a manufacturing device for a wire harness, and the wire harness and a retention component manufactured thereby, the wire harness including a wiring bundle, a retention portion configured to retain the wiring bundle, and an engagement portion to be attached to a vehicle body, the manufacturing method and the manufacturing device being capable of efficiently manufacturing the wire harness and being applicable to engagement portions having different shapes.

Method for manufacturing a wire harness

Growing community of inventors

Aichi, Japan

Yuusuke Ito