Sony Semiconductor Solutions Corporation

Yuusaku Kobayashi

Hajime Yamagishi

Shota Hida

Hiroyuki Kawashima

Yoshihisa Kagawa

Ryoichi Nakamura

A semiconductor device according to an embodiment of the present disclosure includes: a first substrate including a first junction portion; and a second substrate including a second junction portion. The second junction portion is joined to the first junction portion. The first substrate further includes a first multilayer wiring layer in which one surface of a first wiring line faces a first insulating layer and another surface opposed to the one surface is in contact with a second insulating layer. The first multilayer wiring layer is electrically coupled to the first junction portion via the first insulating layer. The first wiring line is formed closest to a junction surface with the second substrate. The second insulating layer has a lower relative dielectric constant than a relative dielectric constant of the first insulating layer.

Semiconductor device and method of manufacturing semiconductor device

An imaging device comprises a first chip that includes a first semiconductor substrate including a photoelectric conversion region. The first chip includes a first insulating layer including a first multilayer wiring electrically connected to the photoelectric conversion region. The first multilayer wiring includes a first vertical signal line (VSL) to output a first pixel signal, and a first wiring. The imaging device includes a second chip including a second semiconductor substrate including a logic circuit. The second chip includes a second insulating layer including a second multilayer wiring electrically connected to the logic circuit. The second multilayer wiring includes a second wiring. The first chip and the second chip are bonded to one another, and, in a plan view, the first wiring and the second wiring overlap with at least a portion of the first vertical signal line (VSL).

Imaging device and electronic device

Imaging device and electronic device configured by bonding a plurality of semiconductor substrates

Imaging device and electronic device configured by bonding a plurality of semiconductor substrates including a first multilayer having a first vertical signal line formed in a differrent layer than the layer of a first wiring of a first connection region

Growing community of inventors

Nagasaki, Japan

Yuusaku Kobayashi