Sumitomo Electric Industries, Limited

Sumitomo Electric Fine Polymer, Inc.

Yuuki Yabe

Shinya Nishikawa

Satoshi Yamasaki

Ryota Fukumoto

Ryohei Fujita

A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa&#xb7;s or less at a shear rate of 1 sat the heat shrinkage temperature and a viscosity of 100 Pa&#xb7;s or more at a shear rate of 1 sat the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.

Heat-shrinkable tube, heat-shrinkable cap, and method of waterproofing electrical wire bundle

A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa&#xb7;s or less at a shear rate of 1 sat a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa&#xb7;s or more at a shear rate of 1 sat the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.

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Osaka, Japan

Yuuki Yabe