Oki Electric Industry Co., Ltd.

Yuuki Shinohara

Takahito Suzuki

Toru Kosaka

Yusuke Nakai

Hironori Furuta

Chihiro Takahashi

Kenichi Tanigawa

Shinya Jyumonji

Takuma Ishikawa

Hiroto Kawada

Genichirou Matsuo

Genichiro Matsuo

A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.

Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof

A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.

Composite integrated film, composite integrated film supply wafer, and semiconductor composite device

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Tokyo, Japan

Yuuki Shinohara