Growing community of inventors

Hitachi, Japan

Yuuki Nakamura

Average Co-Inventor Count = 2.82

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 29

Yuuki NakamuraKazutaka Honda (4 patents)Yuuki NakamuraTetsuya Enomoto (4 patents)Yuuki NakamuraKeiichi Hatakeyama (4 patents)Yuuki NakamuraTsutomu Kitakatsu (2 patents)Yuuki NakamuraYouji Katayama (2 patents)Yuuki NakamuraYuuki Nakamura (8 patents)Kazutaka HondaKazutaka Honda (12 patents)Tetsuya EnomotoTetsuya Enomoto (11 patents)Keiichi HatakeyamaKeiichi Hatakeyama (9 patents)Tsutomu KitakatsuTsutomu Kitakatsu (4 patents)Youji KatayamaYouji Katayama (3 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Hitachi Chemical Company, Ltd. (8 from 1,641 patents)


8 patents:

1. 9129898 - Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device

2. 9123734 - Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

3. 9024455 - Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device

4. 8674502 - Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

5. 8404564 - Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them

6. 8232185 - Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film

7. 8198176 - Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

8. 8071465 - Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

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