Senju Metal Industry Co., Ltd.

Yuuki Iijima

Takashi Saito

Shunsaku Yoshikawa

Kanta Dei

Takahiro Matsufuji

Hiroshi Okada

Naoko Izumita

Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Solder alloy, solder ball, and solder joint

Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition consisting of, by mass %, —Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, and Ge: 0.001 to 0.015% with the balance being Sn

Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint

Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy having an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.2 to 5.00% of Bi, 0.005 to 0.09% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.013≤(Ag+Cu+Ni+Bi)×Ge≤0.027 (1), Sn×Cu×Ni≤5.0 (2). Ag, Cu, Ni, Bi, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Lead-free and antimony-free solder alloy, solder ball, and solder joint

A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.

Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device

A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)&#x2264;0.945% (relation (1)), (P+Ge)&#x2264;0.15% (relation (2)), 2.0&#x2264;(Cu+5Ni)/(P+Ge)&#x2264;1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.

Solder alloy, cast article, formed article, and solder joint

A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

Growing community of inventors

Tokyo, Japan

Yuuki Iijima