Toyota Jidosha Kabushiki Kaisha

Yuuki Ide

Takuya Kadoguchi

Kiyofumi Nakajima

Yuuto Tanaka

A semiconductor module has a structure in which a semiconductor device, an insulating sheet, and a cooler are stacked on each other. The semiconductor device includes a semiconductor element, a heat transfer plate that is connected to the semiconductor element, and a resin molding that seals the semiconductor element and the heat transfer plate. A side surface of the resin molding is inclined away from a center of the resin molding relative to a perpendicular direction to a contact surface of the resin molding that is in contact with the insulating sheet. An angle of inclination of the side surface relative to the perpendicular direction is 3 degrees or larger and 17 degrees or smaller.

Growing community of inventors

Toyota, Japan

Yuuki Ide