Nec Corporation

Nec Access Technica, Ltd.

Yuuki Fujimura

Shinji Watanabe

Nobuyuki Sato

Katsumi Kikuchi

Hideki Sasaki

Katsuhiko Suzuki

Takao Yamazaki

Tomoo Murakami

Shizuaki Masuda

Ryoji Osu

Kikuo Wada

A semiconductor device in which a plurality of semiconductor chips is stacked. A first semiconductor chip is stacked in a region, on a second semiconductor chip, in which a circuit that generates noise is not disposed within said second semiconductor chip, and a wire of a circuit that easily receives noise within said first semiconductor chip is disposed so as not to extend over said circuit that generates noise.

Semiconductor device

A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.

Device having electronic components mounted therein and method for manufacturing such device

Growing community of inventors

Minato-ku, Japan

Yuuki Fujimura