The Furukawa Electric Co., Ltd.

Furukawa Circuit Foil Co., Ltd.

Nec Corporation

Suntory Holdings Limited

Teikoku Printing Mfg. Co., Ltd.

Furukawa Circuit Foil., Ltd.

Furkawa Circuit Foil Co., Ltd.

Yuuji Suzuki

Akira Matsuda

Takami Moteki

Kazuhiro Hoshino

Akira Kawakami

Satoshi Fujisawa

Sadao Matsumoto

Yuuki Kikuchi

Hideo Otsuka

Satoshi Suzuki

Kazuya Takahashi

Hiroki Yokoyama

Satoru Zama

Kensaku Shinozaki

Morimasa Tanimoto

Masatoshi Aihara

Teruo Kawada

Takahiro Saito

A container is provided to contain a liquid to be used in a liquid dispenser that is space-saving and enables checking of the amount of remaining liquid, a refilling operation, and maintenance to be readily performed. A stock solution container in which a concentrated stock solution is to be contained and that is to be used in a beverage dispenser to eject a beverage constituted by the concentrated stock solution and a diluent includes: a containing portion having a bag shape and is to contain the concentrated stock solution; and an ejecting portion for ejecting the concentrated stock solution to the outside, the ejecting portion being provided to protrude from the containing portion. An ejection port is provided at a leading end of the ejecting portion, and the concentrated stock solution is ejected from the ejection port as the containing portion deforms based on an external force.

Container

A surface treated electrodeposited copper foil having a smooth M surface; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 &#x3bc;m or smaller and Ra is 0.2 &#x3bc;m or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45&#xb0; C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC is 400 ppm or smaller, and a current density is 20 to 50 A/dm2.

Surface treated electrodeposited copper foil and circuit board

A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil

An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content 'a' of the metal A and a content 'b' of the metal B forming the release layer satisfying an equation:10&#x2266;/()*100&#x2266;70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Ultrathin copper foil with carrier and printed circuit board using same

A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dmto make surface roughness Rz of 0.3 to 10 &#x3bc;m and height of the projection to be 0.3 to 10 &#x3bc;m. Surface roughness of the original foil is 0.1 to 5 &#x3bc;m and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Laminated circuit board

An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation:10&#x2266;/()*100&#x2266;70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

Method for preparing a circuit board material having a conductive base and a resistance layer

An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation:10&#x2266;/()*100&#x2266;70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited with roughening particles to make the treated copper foil having a roughening treated side with surface roughness of 1.5 to 4.0 &#x3bc;m and luminosity of not more than 30, having projections formed from the roughening particles with a height of 1 to 5 &#x3bc;m, preferably 6 to 35 thereof are uniformly distributed in a 25 &#x3bc;m of surface length of copper foil cross-section observed, and its maximum width being at least 0.01 &#x3bc;m and not more than twice of 25 &#x3bc;m divided by the number of projections in the 25 &#x3bc;m surface length.

Treated copper foil and circuit board

An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 &#x3bc;m, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 &#x3bc;m by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board

A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

Conductive substrate with resistance layer, resistance board, and resistance circuit board

In a gateway system for connecting a telephone network utilizing a common channel signaling system No. 7 to an IP (Internet Protocol) network, the gateway system includes a media gateway and a media gateway controller group including a plurality of media gateway controllers which are assigned a common point code. Any one of the media gateway controllers is for terminating a No. 7 signal representative of a control signal of the common channel signaling system No. 7 in the telephone network and for carrying out call control and connection control to the IP network by controlling the media gateway through the IP network so that a communication path is established between the telephone network and the media gateway. Each of the media gateway controllers comprises a No. 7 signal processing portion for terminating the No. 7 signal and a call processing control portion for carrying out the call control and the connection control to the IP network by controlling the media gateway through the IP network so that the communication path is established between the telephone network and the media gateway. The No. 7 signal processing portion and the call processing control portion have a M3UA (SS7 (Signaling System No. 7) MTP3-User Adaptation Layer) function.

Gateway system having a redundant structure of media gateway controllers

An ink comprises 100 parts by weight of an aluminum flake containing aluminum flakes of 0.5 &#x3bc;m or less, more preferably 0.3 &#x3bc;m or less, in thickness and 20 &#x3bc;mto 2,000 &#x3bc;min flake area in a content of 75% or more, 3 to 200 parts by weight of a binding agent, and 600 to 4,000 parts by weight of a solvent, wherein the solvent is the one containing 20 wt % or more of 3-methyl-3-methoxy-1-butanol (MMB).

Ink, production method of the same materials for producing the same and printed matter with the same

An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.

Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier

Provided is a method for manufacturing a reflow-plated member, which comprises a process for forming a plated layer of Sn or Sn alloy on the surface of a base material, at least the surface of which is formed of Cu or Cu alloy, by electroplating, and a process for running the base material at a traveling speed equivalent to 80% to 90% of the lowest traveling speed that said plated layer does not melt when the base material is continuously run for reflowing in a heating furnace at a predetermined temperature. The obtained reflow-plated member is excellent in any of properties including solderability, heat resistance, bendability, wear resistance, and corrosion resistance.

Growing community of inventors

Tokyo, Japan

Yuuji Suzuki