Hitachi, Ltd.

Yuuji Ochiai

Tatsuya Suzuki

Kazushige Hashimoto

Masahide Harada

Tasao Soga

Tetsuya Nakatsuka

Hanae Shimokawa

Tsuneaki Kamei

A recycle system for a manufactured article including an input unit which inputs first information relating to the manufactured article and a storage unit which stores second information relating to recycle processes and third information relating to materials to be controlled by the recycle system. A computation unit is provided which determines whether or not the first information includes information indicative of at least one of the materials stored as the third information, and which selects a recycle process from the second information according to the result of determination, and an output unit is provided which outputs information of the selected recycle process.

Manufactured article recycling system

Provided is a lead-free solder for connecting LSI and parts on organic substrates, which can provide soldering at a maximum temperature of 220.degree.-230.degree. C. and which has a sufficient reliability in mechanical strength even at a high temperature of 150.degree. C. Also provided are electronic products prepared using this lead-free solder. The lead-free solder has a solder composition including 3-5% Zn and 10-23% Bi, the balance being Sn. Preferably, the solder composition is a composition (Sn, Zn, Bi) surrounded by lines connecting A and B, B and C and C and A, where A is (85, 5, 10 ), B is (72, 5, 23) and C is (76, 3, 21), of a ternary diagram having pure Sn, pure Zn and pure Bi at the vertices of an equilateral triangle. Through use of this solder, it is possible to solder parts, etc. on conventionally employed organic substrates at reflow temperatures equivalent to those for conventional Pb--Sn eutectic solders. The solder does not damage the environment, can be stably supplied and is low in cost.

Lead-free solder used for connecting electronic parts on organic

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Tokyo, Japan

Yuuji Ochiai