Mitsubishi Denki Kabushiki Kaisha

Yuuji Kishimoto

Yoshiharu Takahashi

Yasuo Tada

Seiji Takemura

Junko Itoh

Keitaro Tsukui

Sakae Kiguchi

Eitaro Nagai

Setsuhiro Shimomura

Tomoya Yamakawa

A heat-sensitive flow rate sensor in which a fluid shield is provided so as to cover at least part of a flow velocity probe disposed in a detecting tube, thereby preventing part of heat-sensitive resistor from being directly subjected to change in the flow velocity of a fluid. Temperature of the heat-sensitive resistor is maintained substantially constant even when the fluid flow rate has been drastically changed, thus providing good response characteristic of the flow rate sensor.

Heat-sensitive flow rate sensor

A semiconductor pressure sensor device that improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10. By wire bond receiving projection 4 and supporting projection 11, stress acting on the semiconductor pressure sensor chip 50 is decreased to improve the measuring accuracy.

Method of manufacturing semiconductor pressure sensor device with two

A semiconductor pressure sensor device that can improve the measuring accuracy without providing a silicon base in attaching a semiconductor pressure sensor chip to a lead frame, and a method of manufacturing thereof is disclosed. The semiconductor pressure sensor device includes a die-bond adhesive 10 formed of a resilient material for fixing a semiconductor pressure sensor chip 50 to a lead frame 100, a wire bond receiving projection 4 provided in the diepad where the semiconductor pressure sensor chip 50 is attached for receiving pressure application force from the bottom of the semiconductor pressure sensor chip 50 at the time of wire bonding, and a supporting projection 11 for preventing distortion stress by the wire bond receiving projection 4 from being transmitted. Thermal distortion of the semiconductor pressure sensor chip 50 and the lead frame 100 is absorbed by die-bond adhesive 10. By wire bond receiving projection 4 and supporting projection 11, stress acting on the semiconductor pressure sensor chip 50 is decreased to improve the measuring accuracy.

Semiconductor pressure sensor device with two semiconductor pressure

A fuel injection control system for an internal combustion engine in which the amount of fuel injected per input stroke of the engine is precisely controlled so that a predetermined constant air-to-fuel ratio is maintained at all times. A fuel flow arithmetic unit, operating from inputs supplied from a sensor which detects the pressure in the intake manifold of the engine, calculates a fuel flow amount per intake stroke. The output of the fuel flow arithmetic unit is applied as an address input to a memory in which are prestored values of driving times for each value supplied from the fuel flow arithmetic unit. The driving times are calculated taking into account the non-zero opening and closing times of the fuel injection valves, thereby eliminating nonlinearities in the fuel flow amount driving time characteristics. A driving signal generating circuit drives (opens) the fuel injection valves for times indicated by the driving times outputted by the memory.

Fuel injection control system for internal combustion engine

An electric-type air-to-fuel ratio control system for an internal combustion engine in which the air-to-fuel ratio sucked into the cylinders of the engine is maintained substantially constant following abrupt deceleration. In accordance with the invention, a bypass flow of air is provided into the intake manifold of the engine downstream of the throttle valve and a fuel injection valve using an electrically controlled air supplying device. The air supplying device is opened following closure of the throttle valve to supply an additional flow of air which compensates for overrichness in the air-to-fuel mixture caused by the delay of fuel injected from the fuel injection valve to the cylinders of the engine. Preferably, the time during which air is supplied through the air supplying device and the flow rate of air therethrough is adjusted so as to maintain a predetermined air-to-fuel ratio following deceleration.

Growing community of inventors

Hyogo, Japan

Yuuji Kishimoto