Sony Corporation

Sony Semiconductor Solutions Corporation

Sony Group Corporation

Yuuji Kishigami

Hidetsugu Otani

Junichi Tokunaga

Atsushi Yoshida

Yoshihiro Nabe

Seiya Tsuzaki

Noboru Kawabata

To reduce deformation of an imaging device and to prevent a reduction in image quality. The imaging device includes an imaging element, a substrate, and a connection portion. The substrate included in the imaging device is formed of an organic substrate and an inorganic substrate, the organic substrate including an insulation layer that is made of an organic material, the inorganic substrate including an insulation layer that is made of an inorganic material. The imaging element included in the imaging device is bonded to the substrate. The connection portion included in the imaging device connects the substrate included in the imaging device and the imaging element included in the imaging device.

Imaging device and method for producing imaging device

The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Imaging apparatus, manufacturing apparatus, manufacturing method and electronic appliance

To improve strength of an imaging module with an adjusted optical axis. An imaging device includes an imaging module and a holding unit. The imaging module provided in the imaging device includes an imaging element that images incident light introduced from an upper surface of a housing. The holding unit provided in the imaging device surrounds and holds a side surface of the imaging module, the side surface being adjacent to the upper surface of the housing. The holding unit surrounds and holds the side surface of the imaging module, thereby protecting the imaging module.

Imaging device and method of manufacturing imaging device

The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.

Provided is a module including an organic substrate, an image sensor mounted on an upper surface of the organic substrate, a wire connecting the image sensor and the organic substrate, and a wire sealing unit adhered to a side surface of the image sensor while encompassing the wire. A thermal conductivity of the wire sealing unit is higher than a thermal conductivity of the organic substrate.

Module, method for manufacturing module, and electronic device

The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.

Compound-eye camera module and electronic device

A manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. The imaging apparatus includes a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF).

The present technology relates to an imaging apparatus and a manufacturing method of the imaging apparatus. A glass plateis mounted at a position corresponding to an opening portionon a substrate. An imaging deviceis mounted at a position with an optically appropriate distance in terms of design based on a surface of the glass plateon a face of the substrateopposite to a face on which the glass plateis mounted, at a position corresponding to the opening portion. A lens barrel portionis placed so that the optical system blockis set at a position with an optically appropriate distance on the glass plate, and fixed with an adhesive

Imaging apparatus and manufacturing method of imaging apparatus, and electronic equipment and manufacturing method of electronic equipment

Imaging apparatus and electronic appliance for realizing a miniaturized module

The present technology relates to a semiconductor apparatus, a solid state imaging device, an imaging apparatus and electronic equipment which realize a smaller and thinner size and which enable improvement of optical characteristics, and a manufacturing method thereof. A side electrodeis formed on a side face of a substrate on which an imaging deviceis formed. By this side electrodebeing connected to an electrode padon the substratethrough a chip wiringformed with solder, the imaging deviceis electrically connected to the substrate. By this means, because it is possible to electrically connect the imaging deviceto the substratewithout using wire bonding, space required for wire bonding is not required, so that it is possible to realize a smaller and thinner apparatus. The present technology can be applied to an imaging apparatus.

Semiconductor apparatus, solid state imaging device, imaging apparatus and electronic equipment, and manufacturing method thereof

A solid-state imaging unit includes: a solid-state imaging device mounted on a substrate; a bonding wire which electrically connects a pad formed on the solid-state imaging device and a lead formed on the substrate; a frame member having a frame shape which surrounds side portions of the solid-state imaging device; and an optical member having optical transparency and mounted on the frame member so as to face an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion which protrudes from an optical member side toward the imaging surface of the solid-state imaging device, and the frame member and the solid-state imaging device are integrally fixed to each other in a state where the leg portion comes into contact with an intermediate area which is located between an imaging area and a pad forming area on the imaging surface.

Growing community of inventors

Kumamoto, Japan

Yuuji Kishigami