Fujitsu Corporation

Fujitsu Semiconductor Limited

Yuuji Hasegawa

Manabu Miyamoto

Toshimitsu Kobayashi

Kazuo Hirafuji

Yukio Ando

Kenichi Yazaki

Yuuzou Hamanaka

Keiichi Sasamura

Kouichi Shinya

The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes. In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.

Carrier tape, electronic-component accommodating member and method of transporting electronic component

A heat exchanger includes a plurality of unit modules aligned in parallel, in which each unit module has a heat exchange function.

Heat exchanger

A communication device which efficiently dissipates locally generated heat, and at the same time is small in size and light in weight, is provided. A high-efficiency heat-dissipating fin section having fins disposed on an heat pipe which is bent into an S shape is mounted on a high-temperature heat-generating section that generates high-temperature heat. A heat-dissipating fin section having fins disposed on a heat-receiving plate thereof is mounted on a low-temperature heat-generating section that generates heat having a lower temperature than that of the high-temperature heat generated by the high-temperature heat-generating section. This makes it possible to efficiently dissipate heat and reduce the size and weight of the communication device.

Communication device

A transmitting and amplifying unit for a wireless communication device. The transmitting and amplifying unit includes a C-shaped frame having an upper plate having a first cutout, a lower plate having a second cutout aligned with the first cutout, and a side plate connecting the upper plate and the lower plate; a main amplifier unit fixed to the lower plate and having a concentrated heating portion; and a subamplifier unit fixed to the upper plate. The transmitting and amplifying unit further includes a radiating fin unit mounted on the concentrated heating portion of the main amplifier unit and extending upward through the first cutout of the lower plate and the second cutout of the upper plate. The radiating fin unit has an upper end fixed to the subamplifier unit. The transmitting and amplifying unit further includes a cooling fan fixed to the C-shaped frame, and a printed wiring board mounted on the C-shaped frame so as to face the side plate, whereby a duct is formed between the C-shaped frame and the printed wiring board.

Growing community of inventors

Kawasaki, Japan

Yuuji Hasegawa