Kyocera Corporation

Yuuichi Abe

Kunihide Shikata

Kazuhiro Ishikawa

Kiyotaka Nakamura

Keiichi Sekiguchi

Yoshio Ohashi

Kenji Komatsubara

Eisuke Hirano

Kiyoshi Yakubo

Youhei Taniguchi

A circuit substrate is provided with a base formed of ceramics. It includes a first face a second face; and a through hole penetrating from the first face to the second face; a through conductor: containing silver and copper as main components; disposed inside the through hole; and including a plurality of surfaces; and a metal layer in contact with at least one of the plurality of surfaces. The through conductor includes a eutectic region of silver and copper, disposed in a metal layer side of a diametrically center region of the through conductor; and a non-eutectic region of silver and copper, disposed in a central region of the diametrically center region of the through conductor.

Circuit substrate, and electronic device including same

A circuit board includes: a base body formed of ceramics or sapphire, the base body being provided with a through hole which penetrates therethrough from one principal face to another principal face of the base body; a through conductor containing silver as a major constituent, the through conductor being located inside the through hole of the base body; metallic wiring layers located on the respective principal faces of the base body and on the through conductor; and regions in which a compound containing at least one substance selected from Sn, Cu, and Ni is present between the through conductor and the metallic wiring layers.

Circuit board and electronic device provided with same

A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.

Circuit board and electronic device including same

A brazing material includes silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten. The content of copper is not less than 35% by mass and not more than 50% by mass, based on the total amount of silver, copper, and the elements A, B and C. A heat dissipation base includes a supporting substrate, circuit members on a first main surface of the substrate, and a heat dissipation member on a second main surface opposite to the first main surface. The circuit members are joined to the supporting substrate by a joining layer composed of the brazing material.

Growing community of inventors

Satsumasendai, Japan

Yuuichi Abe