Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Yuu Yamayose

Tetsuya Kugimiya

Kazuya Fukuhara

Kenji Hirohata

Manabu Takakuwa

Yosuke Okamoto

Kazutaka Ishigo

Kazuhiro Segawa

Kentaro Kasa

Yoshinori Hagio

Yuki Murasaka

According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.

Electronic device, abnormality determination method, and computer program product

A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

Pattern accuracy detecting apparatus and processing system

A substrate includes a join-structure including a semiconductor package, first electrode pad, bump, second electrode pad, and circuit substrate joined in the order named. The substrate also includes a first wire and a second wire formed in a region below a corner of the semiconductor package. The first and second wires are configured to detect a change in electrical resistance value when the first wire or the second wire is disconnected. One of the first and second wires is connected to the first electrode pad or the second electrode pad. A break strength of each of the first wire and the second wire is lower than a break strength of the join-structure.

Substrate and method for mounting semiconductor package

Growing community of inventors

Tokyo, Japan

Yuu Yamayose