Nitto-denko Corporation

Yuu Sugimoto

Seiji Umemoto

Takuya Nakazono

Jun Ishii

Kentarou Takeda

Hiroyuki Tanabe

Yoshito Fujimura

Naohiro Terada

Katsutoshi Kamei

Daisuke Yamauchi

Akinori Izaki

Saori Kanezaki

Hitoki Kanagawa

Shouji Yamamoto

Mitsuru Suzuki

Tetsushi Kunitake

Takatoshi Sakakura

Kouji Ichinose

Youhei Shirafuji

Saori Ishigaki

Kimihide Kitamura

Kouzou Nakamura

A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.

Producing method of wired circuit board

A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Wired circuit board and producing method thereof

The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.

Wired circuit board and production method thereof

Wired circuit board including a conductive pattern having a wire and a dummy portion

In a method for producing a wired circuit board includes a step (), in which the insulating layer having an inclination face is provided; a step (), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (), in which a photoresist is provided on the surface of the metal thin film; a step (), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (), in which the first light exposure portion and the second light exposure portion are removed; and a step (), in which the first wire and the second wire are provided on the surface of the metal thin film.

Production method of wired circuit board

A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.

Method for producing wired circuit board

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.

Suspension board assembly sheet having circuits, method of manufacturing the same and method of inspecting the same

The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.

Wired circuit board

The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist. When exposing the photoresist, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion.

A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.

Suspension board with circuit having thinned insulating second portion overlapping second terminal

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

Suspension board with circuit and producing method thereof

A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness direction of the metal pedestal portion as the first conductive layer, and an upper conductive layer as the second conductive layer formed on one side in the thickness direction of the lower conductive layer as the first conductive layer, wherein one of the lower conductive layer as the first conductive layer and the upper conductive layer as the second conductive layer is disposed in the pedestal opening when projected in the thickness direction, and the periphery of the other is disposed outside of the pedestal opening when projected in the thickness direction.

Wired circuit board having one of the conductive layers disposed in an opening formed in metal supporting board

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.

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Osaka, Japan

Yuu Sugimoto