Kansai Paint Company, Ltd.

Mitsubishi Denki Kabushiki Kaisha

Yuu Akaki

Naozumi Iwasawa

Kenji Seko

Toshio Kondo

Isao Kobayashi

Masahiro Hoshino

Disclosed is an electrodeposition coating composition for use in printed circuit board photo resist, comprising (a) an acrylic resin containing (meth)acryloyl group and obtained by use of diacetone (meth)acrylamide as an essential monomer component, said acrylic resin being a water-soluble or water-dispersible photo-curable unsaturated resin having an acid value of 20 to 300, a degree of unsaturation of 0.2 to 4.5 moles/kg, a number average molecular weight of 1,000 to 100,000 and a glass transition temperature of 0.degree. to 100.degree. C., and (b) a water-insoluble photopolymerization initiator.

Electrodeposition coating composition for use in printed circuit board

A positive-type photosensitive electrodeposition coating composition comprising as a main component a water-soluble or water-dispersible resin containing modified quinonediazidesulfone units represented by the following formula (I) ##STR1## wherein R.sub.1 represents ##STR2## or ##STR3## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, and

Positive-type photosensitive electrodeposition coating composition with

An electrodeposition coating process of a photoresist for printed circuit board which comprises electrodeposition coating on a conductive surface a photosensitive electrodeposition coating composition (A), and thereafter further electrodeposition coating on the resultant coated plate an electrodeposition coating composition (B) composed chiefly of water-soluble or water-dispersible resin having a glass transition temperature (Tg) not lower than 20.degree. C.

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Hiratsuka, Japan

Yuu Akaki