Honda Motor Co., Ltd.

Yuto Ike

Akiyoshi Miyawaki

Taichi Kurihara

A bonding device is used to bond a plate assembly including a first plate and a second plate and includes an anvil, a probe, a shoulder component, a driving mechanism, a power supply, and a control part. The anvil is configured to support a first surface of the plate assembly provided by the first plate. The probe is disposed at a position corresponding to the anvil to be opposite to a second surface of the plate assembly provided by the second plate. The shoulder component is disposed around the probe and has a via for the probe to pass through and an abutting surface for pressing the second surface. The anvil has a hemispherical surface facing the first surface and a receiving surface disposed at a position corresponding to the abutting surface. The anvil contacts the first surface with the hemispherical surface and the receiving surface.

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Saitama, Japan

Yuto Ike